EP 2745324 A2 20140625 - FLIP-CHIP BONDED IMAGER DIE
Title (en)
FLIP-CHIP BONDED IMAGER DIE
Title (de)
AN BILDGEBERMATRIZE GEBONDETER FLIP-CHIP
Title (fr)
PUCE D'IMAGEUR À CONNEXION PAR BILLES
Publication
Application
Priority
- US 201161525372 P 20110819
- US 2012051573 W 20120820
Abstract (en)
[origin: WO2013028616A2] An image sensor includes an imager die, a circuit board, and an optical layer. The circuit board is flip-chip bonded to the imager die. The optical layer is adhered to the circuit board and includes a first portion configured to refract light differently than a second portion. Both the first portion and the second portion are integrally formed with the optical layer.
IPC 8 full level
H01L 27/146 (2006.01)
CPC (source: EP)
H01L 27/14618 (2013.01); H01L 2924/0002 (2013.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01)
Citation (search report)
See references of WO 2013028616A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2013028616 A2 20130228; WO 2013028616 A3 20130627; EP 2745324 A2 20140625; JP 2014527722 A 20141016; KR 20140083993 A 20140704
DOCDB simple family (application)
US 2012051573 W 20120820; EP 12768926 A 20120820; JP 2014526271 A 20120820; KR 20147007313 A 20120820