EP 2749670 A1 20140702 - Formaldehyde free electroless copper plating compositions and methods
Title (en)
Formaldehyde free electroless copper plating compositions and methods
Title (de)
Formaldehydfreie, stromlose Verkupferungszusammensetzungen und Verfahren
Title (fr)
Compositions et procédés de dépôt autocatalytique de cuivre exempt de formaldéhyde
Publication
Application
Priority
- US 201261746112 P 20121226
- US 201313769332 A 20130217
Abstract (en)
The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
IPC 8 full level
C23C 18/40 (2006.01)
CPC (source: EP KR US)
C09D 1/00 (2013.01 - US); C23C 18/38 (2013.01 - KR); C23C 18/40 (2013.01 - EP KR US); H05K 3/187 (2013.01 - EP US); H01B 1/02 (2013.01 - EP US)
Citation (applicant)
- US 4265943 A 19810505 - GOLDSTEIN RACHEL, et al
- US 5562760 A 19961008 - BALLARD GERALD L [US], et al
- US 6046107 A 20000404 - LEE CHWAN-YING [TW], et al
- US 6534117 B1 20030318 - YOSHIO AKIRA [JP], et al
- US 7473307 B2 20090106 - SONG KI YONG [KR], et al
- US 4684550 A 19870804 - MILIUS JOHN W [US], et al
- US 4818286 A 19890404 - JAGANNATHAN RANGARAJAN [US], et al
Citation (search report)
- [XI] FR 824356 A 19380207 - SAINT GOBAIN
- [XI] US 5302278 A 19940412 - NOBEL FRED I [US], et al
- [A] FR 1066000 A 19540601 - W KAMPSCHULTE & CO DR
- [A] US 3649350 A 19720314 - AGENS MAYNARD C
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2749670 A1 20140702; CN 103898489 A 20140702; CN 103898489 B 20160824; JP 2014129598 A 20140710; JP 6307266 B2 20180404; KR 20140083911 A 20140704; TW 201432090 A 20140816; TW I527931 B 20160401; US 2014178572 A1 20140626; US 2015376795 A1 20151231; US 9611550 B2 20170404; US 9809883 B2 20171107
DOCDB simple family (application)
EP 13199394 A 20131223; CN 201310757407 A 20131226; JP 2013265877 A 20131224; KR 20130164005 A 20131226; TW 102148129 A 20131225; US 201313769332 A 20130217; US 201514796459 A 20150710