EP 2750493 A2 20140702 - Cooling heat-generating electronics
Title (en)
Cooling heat-generating electronics
Title (de)
Kühlung einer Wärmeerzeugungselektronik
Title (fr)
Refroidissement de dispositifs électroniques thermogènes
Publication
Application
Priority
- US 95785510 A 20101201
- EP 11799544 A 20111201
Abstract (en)
A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.
IPC 8 full level
H01L 23/427 (2006.01); H01L 23/467 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01)
CPC (source: EP US)
H01L 23/427 (2013.01 - US); H05K 7/20336 (2013.01 - EP US); H05K 7/20445 (2013.01 - EP US); H05K 7/20718 (2013.01 - US); H05K 7/20727 (2013.01 - EP US); H05K 7/20809 (2013.01 - US); H01L 23/467 (2013.01 - US); H01L 2924/0002 (2013.01 - EP US); H05K 7/20163 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
US 2012140403 A1 20120607; US 8644020 B2 20140204; CN 103329641 A 20130925; CN 103329641 B 20160309; EP 2647273 A1 20131009; EP 2647273 B1 20140402; EP 2750493 A2 20140702; EP 2750493 A3 20140806; EP 2750493 B1 20160330; HK 1199351 A1 20150626; SG 190896 A1 20130731; TW 201238461 A 20120916; TW I559844 B 20161121; US 2014146466 A1 20140529; US 9313926 B2 20160412; WO 2012075300 A1 20120607
DOCDB simple family (application)
US 95785510 A 20101201; CN 201180065948 A 20111201; EP 11799544 A 20111201; EP 14160571 A 20111201; HK 14112748 A 20141219; SG 2013040738 A 20111201; TW 100144304 A 20111201; US 2011062907 W 20111201; US 201414171510 A 20140203