Global Patent Index - EP 2755819 A4

EP 2755819 A4 20150415 - COATED ARTICLES, ELECTRODEPOSITION BATHS, AND RELATED SYSTEMS

Title (en)

COATED ARTICLES, ELECTRODEPOSITION BATHS, AND RELATED SYSTEMS

Title (de)

BESCHICHTETE GEGENSTÄNDE, ELEKTROTAUCHBESCHICHTUNGSBÄDER UND ZUGEHÖRIGE SYSTEME

Title (fr)

ARTICLES REVÊTUS, BAINS D'ÉLECTRODÉPOSITION ET SYSTÈMES ASSOCIÉS

Publication

EP 2755819 A4 20150415 (EN)

Application

EP 12831829 A 20120914

Priority

  • US 201113232261 A 20110914
  • US 201113232291 A 20110914
  • US 2012055495 W 20120914

Abstract (en)

[origin: WO2013040400A1] Coated articles, electrodeposition baths, and related systems are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

IPC 8 full level

B32B 15/20 (2006.01); C25D 3/64 (2006.01); C25D 5/10 (2006.01); C25D 5/12 (2006.01); C25D 5/48 (2006.01); C25D 5/18 (2006.01); C25D 21/14 (2006.01)

CPC (source: CN EP US)

C25D 3/64 (2013.01 - CN EP US); C25D 5/10 (2013.01 - CN EP US); C25D 5/12 (2013.01 - CN EP US); C25D 5/48 (2013.01 - EP); C25D 5/617 (2020.08 - CN EP US); C25D 5/619 (2020.08 - CN EP US); C25D 5/623 (2020.08 - CN EP US); C25D 5/627 (2020.08 - CN EP US); C25D 5/18 (2013.01 - CN EP US); C25D 21/14 (2013.01 - EP)

Citation (search report)

  • [I] US 5225253 A 19930706 - TUNG SIMON C [US], et al
  • [A] US 2011014488 A1 20110120 - PALUMBO GINO [CA], et al
  • [I] NIKOLA RADIC ET AL: "Thin films of completely immiscible Ag-W system", CROATIAN SCIENTIFIC BIBLIOGRAPHY (CROSBI), 8 January 2008 (2008-01-08), XP055173398, Retrieved from the Internet <URL:https://bib.irb.hr/prikazi-rad?rad=316918&table=zbornik&lang=en&print=true> [retrieved on 20150303]
  • [I] BOGUSH V ET AL: "Electroless deposition of novel Ag-W thin films", MICROELECTRONIC ENGINEERING, ELSEVIER PUBLISHERS BV., AMSTERDAM, NL, vol. 70, no. 2-4, November 2003 (2003-11-01), pages 489 - 494, XP004467966, ISSN: 0167-9317, DOI: 10.1016/S0167-9317(03)00414-3
  • See references of WO 2013040400A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2013040400 A1 20130321; CN 104080606 A 20141001; CN 104080606 B 20161207; CN 106947986 A 20170714; CN 106947986 B 20190719; EP 2755819 A1 20140723; EP 2755819 A4 20150415; EP 2755819 B1 20160914; JP 2014526615 A 20141006; JP 6159726 B2 20170705

DOCDB simple family (application)

US 2012055495 W 20120914; CN 201280055952 A 20120914; CN 201611001346 A 20120914; EP 12831829 A 20120914; JP 2014530869 A 20120914