EP 2758471 A1 20140730 - POLYAMIDE MOLDING COMPOUNDS
Title (en)
POLYAMIDE MOLDING COMPOUNDS
Title (de)
POLYAMID-FORMMASSEN
Title (fr)
MATIÈRES À MOULER EN POLYAMIDE
Publication
Application
Priority
- EP 11182184 A 20110921
- EP 2012067796 W 20120912
- EP 12761580 A 20120912
Abstract (en)
[origin: EP2573138A1] Thermoplastic molding compound comprises (a) 80-99.5 wt.% a polyamide; (b) 0.5-20 wt.% of a co-polyester; (c) 0-60 wt.% of fibrous reinforcement material; and (d) 0-10 wt.% of further additives, where the co-polyester comprises (b1) 40-80 wt.% of succinic acid, adipic acid, azelaic acid, sebacic acid, brassylic acid and/or or its ester-forming derivatives, (b2) 20-60 wt.% of terephthalic acid and/or its ester forming derivatives, (b3) 98-102 mol.% of 1,4 butanediol and/or 1,3-propanediol, (b4) 0-1 wt.% of a splitter, (b5) 0-2 wt.% of a chain extender and (b6) 0-2 wt.% of further additives. Thermoplastic molding compound comprises (a) 80-99.5 wt.% a polyamide; (b) 0.5-20 wt.% of a co-polyester having a viscosity number, according to DIN 53728, of 150-320 cm 3>/g; (c) 0-60 wt.% of fibrous reinforcement material; and (d) 0-10 wt.% of further additives, where the co-polyester comprises (b1) 40-80 wt.% of succinic acid, adipic acid, azelaic acid, sebacic acid, brassylic acid and/or or its ester-forming derivatives, (b2) 20-60 wt.% of terephthalic acid and/or its ester forming derivatives, (b3) 98-102 mol.% of 1,4 butanediol and/or 1,3-propanediol, as a diol component, (b4) 0-1 wt.% of a splitter, (b5) 0-2 wt.% of a chain extender and (b6) 0-2 wt.% of further additives.
IPC 8 full level
C08L 77/00 (2006.01); C08L 67/02 (2006.01); C08L 77/02 (2006.01)
CPC (source: CN EP US)
C08L 77/00 (2013.01 - CN EP US); C08L 77/02 (2013.01 - CN EP US); C08K 2201/004 (2013.01 - CN); C08K 2201/014 (2013.01 - CN); C08L 2203/12 (2013.01 - CN)
C-Set (source: CN EP US)
CN
EP US
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2573138 A1 20130327; CN 103814083 A 20140521; EP 2758471 A1 20140730; JP 2014526590 A 20141006; US 2014303311 A1 20141009; WO 2013041422 A1 20130328
DOCDB simple family (application)
EP 11182184 A 20110921; CN 201280046200 A 20120912; EP 12761580 A 20120912; EP 2012067796 W 20120912; JP 2014531172 A 20120912; US 201214346407 A 20120912