Global Patent Index - EP 2759001 A4

EP 2759001 A4 20150429 - LED CHIP AND METHOD FOR MANUFACTURING THE SAME

Title (en)

LED CHIP AND METHOD FOR MANUFACTURING THE SAME

Title (de)

LED-CHIP UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

PUCE DE DIODE ÉLECTROLUMINESCENTE ET SON PROCÉDÉ DE FABRICATION

Publication

EP 2759001 A4 20150429 (EN)

Application

EP 12833315 A 20120822

Priority

  • CN 201110282701 A 20110922
  • CN 2012080472 W 20120822

Abstract (en)

[origin: WO2013040974A1] An LED chip and a method for manufacturing the same are provided. The method comprises steps of: a) providing an epitaxial wafer including a substrate, and a buffer layer, an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer formed on the substrate sequentially; b) forming a conductive layer on the epitaxial wafer, and etching the conductive layer to form a plurality of first grooves in the conductive layer; c) providing a mold having a plurality of protrusions corresponding to the plurality of first grooves, and forming a phosphor layer on a surface of the mold having the plurality of protrusions; d) pressing the mold on the conductive layer vertically, so as to insert the plurality of protrusions into the corresponding first grooves; and e) performing a heat treatment, and removing the mold.

IPC 8 full level

H01L 33/50 (2010.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01)

CPC (source: EP)

H01L 33/20 (2013.01); H01L 33/505 (2013.01); H01L 33/38 (2013.01); H01L 2933/0041 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2013040974 A1 20130328; CN 103022274 A 20130403; CN 103022274 B 20160413; EP 2759001 A1 20140730; EP 2759001 A4 20150429

DOCDB simple family (application)

CN 2012080472 W 20120822; CN 201110282701 A 20110922; EP 12833315 A 20120822