Global Patent Index - EP 2760611 A1

EP 2760611 A1 20140806 - STARTING MATERIAL FOR A SINTERED BOND AND METHOD FOR PRODUCING THE SINTERED BOND

Title (en)

STARTING MATERIAL FOR A SINTERED BOND AND METHOD FOR PRODUCING THE SINTERED BOND

Title (de)

AUSGANGSWERKSTOFF EINER SINTERVERBINDUNG UND VERFAHREN ZUR HERSTELLUNG DER SINTERVERBINDUNG

Title (fr)

MATÉRIAU DE BASE D'UNE LIAISON FRITTÉE ET PROCÉDÉ DE RÉALISATION D'UNE LIAISON FRITTÉE

Publication

EP 2760611 A1 20140806 (DE)

Application

EP 12766629 A 20120921

Priority

  • DE 102011083893 A 20110930
  • EP 2012068644 W 20120921

Abstract (en)

[origin: WO2013045360A1] The invention relates to a sintered bond, a starting material for the same and a method for the production thereof, but also to an electronic circuit containing the sintered bond, wherein the starting material comprises sinterable particles (102) of at least one metal or at least one metal compound and at least one flux (103). According to the invention, the flux (103) is a reducing agent and at the same time the solvent of the starting material (100).

IPC 8 full level

B22F 1/102 (2022.01); B22F 1/105 (2022.01); B22F 1/16 (2022.01)

CPC (source: EP US)

B22F 1/102 (2022.01 - EP US); B22F 1/105 (2022.01 - EP US); B22F 1/16 (2022.01 - EP US); B23K 35/0244 (2013.01 - EP); B23K 35/3006 (2013.01 - EP US); B23K 35/3013 (2013.01 - EP); B23K 35/362 (2013.01 - EP); H01L 24/29 (2013.01 - EP); H01L 24/83 (2013.01 - EP); C22C 1/0425 (2013.01 - EP); C22C 1/0466 (2013.01 - EP); C22C 32/0021 (2013.01 - EP); H01L 2224/29344 (2013.01 - EP); H01L 2224/29347 (2013.01 - EP); H01L 2224/29364 (2013.01 - EP); H01L 2224/29369 (2013.01 - EP); H01L 2224/29486 (2013.01 - EP); H01L 2224/2949 (2013.01 - EP); H01L 2224/32245 (2013.01 - EP); H01L 2224/8384 (2013.01 - EP)

Citation (search report)

See references of WO 2013045360A1

Citation (examination)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2013045360 A1 20130404; DE 102011083893 A1 20130404; EP 2760611 A1 20140806

DOCDB simple family (application)

EP 2012068644 W 20120921; DE 102011083893 A 20110930; EP 12766629 A 20120921