Global Patent Index - EP 2761650 A2

EP 2761650 A2 20140806 - LAYER COMPOSITE FOR CONNECTING ELECTRONIC COMPONENTS COMPRISING A COMPENSATION LAYER, LINKING LAYERS AND CONNECTION LAYERS

Title (en)

LAYER COMPOSITE FOR CONNECTING ELECTRONIC COMPONENTS COMPRISING A COMPENSATION LAYER, LINKING LAYERS AND CONNECTION LAYERS

Title (de)

SCHICHTVERBUND ZUM VERBINDEN VON ELEKTRONISCHEN BAUTEILEN UMFASSEND EINE AUSGLEICHSSCHICHT, ANBINDUNGSSCHICHTEN UND VERBINDUNGSSCHICHTEN

Title (fr)

COMPOSITE STRATIFIÉ CONÇU POUR CONNECTER DES COMPOSANTS ÉLECTRONIQUES, COMPRENANT UNE COUCHE DE COMPENSATION, DES COUCHES DE CONNEXION ET DES COUCHES DE LIAISON

Publication

EP 2761650 A2 20140806 (DE)

Application

EP 12774969 A 20120920

Priority

  • DE 102011083899 A 20110930
  • EP 2012068570 W 20120920

Abstract (en)

[origin: WO2013045345A2] The present invention relates to a layer composite (10), more particularly for connecting electronic components (11, 12) comprising at least one compensation layer (40), at least two linking layers (30) and at least two connection layers (20), wherein the compensation layer (40) is formed from aluminium or molybdenum, an aluminium or molybdenum alloy, from a metal-matrix material composed of aluminium and silicon carbide or composed of aluminium and copper-carbon, or from a copper-molybdenum alloy, wherein a linking layer (30) composed of silver is in each case applied on at least two opposite sides of the compensation layer (40), and wherein a connection layer (20) is in each case applied on the linking layers (30), wherein the connection layers (20) are formed from sinterable and/or sintered metal powder. The invention furthermore relates to a method for forming a layer composite (10) according to the invention, and to a circuit arrangement (100) containing a layer composite (10) according to the invention.

IPC 8 full level

H01L 23/367 (2006.01); H01L 21/60 (2006.01); H01L 23/373 (2006.01); H01L 23/488 (2006.01)

CPC (source: EP)

B23K 35/0238 (2013.01); B23K 35/30 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 23/3735 (2013.01); H01L 23/49513 (2013.01); H01L 24/83 (2013.01); H01L 2221/68354 (2013.01); H01L 2224/2612 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/271 (2013.01); H01L 2224/2712 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/27505 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29164 (2013.01); H01L 2224/29169 (2013.01); H01L 2224/2918 (2013.01); H01L 2224/29224 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/832 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83464 (2013.01); H01L 2224/83469 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/351 (2013.01)

C-Set (source: EP)

  1. H01L 2224/29155 + H01L 2924/01023
  2. H01L 2224/29155 + H01L 2924/01015
  3. H01L 2224/29144 + H01L 2924/01042
  4. H01L 2224/29387 + H01L 2924/04642
  5. H01L 2224/29387 + H01L 2924/0461 + H01L 2924/01029
  6. H01L 2224/83192 + H01L 2224/83101 + H01L 2924/00
  7. H01L 2924/3512 + H01L 2924/00
  8. H01L 2924/15787 + H01L 2924/00
  9. H01L 2924/15747 + H01L 2924/00

Citation (search report)

See references of WO 2013045345A2

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2013045345 A2 20130404; WO 2013045345 A3 20130530; DE 102011083899 A1 20130404; EP 2761650 A2 20140806

DOCDB simple family (application)

EP 2012068570 W 20120920; DE 102011083899 A 20110930; EP 12774969 A 20120920