EP 2763154 A4 20150812 - A LINKAGE STRUCTURE OF THE MOVING CONTACT OF THE MODULAR CIRCUIT BREAKER
Title (en)
A LINKAGE STRUCTURE OF THE MOVING CONTACT OF THE MODULAR CIRCUIT BREAKER
Title (de)
VERKNÜPFUNGSSTRUKTUR DES BEWEGLICHEN KONTAKTES EINES MODULAREN SCHUTZSCHALTERS
Title (fr)
STRUCTURE DE LIAISON DU CONTACT MOBILE D'UN DISJONCTEUR MODULAIRE
Publication
Application
Priority
- CN 201110287701 A 20110926
- CN 2012081803 W 20120924
Abstract (en)
[origin: EP2763154A1] The present invention discloses a moving contact linkage structure of modular circuit breaker. The moving contact linkage structure of modular circuit breaker comprises: a first case having a first mounting hole and the second case having a second mounting hole, the first mounting hole and the second mounting hole corresponding to each other on position; a first shaft; an operation mechanism side plate having a third through hole, the third through hole being positioned at a rotation center of a contact rotor; an operation mechanism lower connecting rod having a fourth through hole, the first shaft connecting to the fourth through hole; a contact rotor being rotatable around a rotation center, the contact rotor having mating surfaces on both sides; a first linkage member connecting to the mating surface on a first side of the contact rotor; a second linkage member connecting to the mating surface on a second side of the contact rotor; the contact rotor, the first linkage member and the second linkage member being mounted in the first mounting hole and the second mounting hole.
IPC 8 full level
H01H 1/20 (2006.01); H01H 71/10 (2006.01); H01H 9/00 (2006.01)
CPC (source: EP)
H01H 1/2041 (2013.01); H01H 1/2058 (2013.01); H01H 71/10 (2013.01); H01H 2009/0088 (2013.01); H01H 2009/0094 (2013.01)
Citation (search report)
- [IY] WO 03050835 A1 20030619 - ABB SERVICE SRL [IT], et al
- [Y] WO 03050830 A1 20030619 - ABB SERVICE SRL [IT], et al
- [I] US 6480082 B1 20021112 - AIHARA KAZUYA [JP], et al
- [I] US 2007063796 A1 20070322 - MATTLAR HARRI [FI], et al
- [I] WO 2011045428 A1 20110421 - SIEMENS AG [DE], et al
- [A] US 6259338 B1 20010710 - BOEDER FRANZ [DE], et al
- See references of WO 2013044765A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2763154 A1 20140806; EP 2763154 A4 20150812; EP 2763154 B1 20170329; BR 112014007148 A2 20170404; BR 112014007148 B1 20210302; CN 103021745 A 20130403; CN 103021745 B 20150325; ES 2622654 T3 20170706; MY 175371 A 20200623; WO 2013044765 A1 20130404
DOCDB simple family (application)
EP 12834733 A 20120924; BR 112014007148 A 20120924; CN 201110287701 A 20110926; CN 2012081803 W 20120924; ES 12834733 T 20120924; MY PI2014000888 A 20120924