EP 2764512 A2 20140813 - STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS IN ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE
Title (en)
STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS IN ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE
Title (de)
STUTZENMINIMIERUNG DURCH DUPLIZIERTE SÄTZE VON SIGNALEMPFANGSVORRICHTUNGEN OHNE DRAHTBINDUNGEN AN VERPACKUNGSSUBSTRATE
Title (fr)
RÉDUCTION AU MINIMUM DES STUBS AU MOYEN D'ENSEMBLES DOUBLES DE BORNES DE SIGNAL DANS DES MONTAGES SANS CONNEXION DES FILS AU SUBSTRAT DU BOÎTIER
Publication
Application
Priority
- US 201161542553 P 20111003
- US 201261600483 P 20120217
- US 201213439317 A 20120404
- US 2012057204 W 20120926
Abstract (en)
[origin: WO2013052320A1] A microelectronic package 100 can include a microelectronic element 101 having element contacts 111, a substrate 102 having first and second surfaces 108, 110, and terminals 104 configured for connecting the package with an external component. The microelectronic element 101 can include a plurality of stacked electrically interconnected semiconductor chips 932, 934. The substrate 102 can have contacts 121 facing the element contacts 111 and joined thereto. The terminals can include first terminals 104 arranged at positions within first and second sets 114, 124 thereof disposed on respective opposite sides of a theoretical axis 132. Each set of first terminals 104 can be configured to carry address information usable by circuitry within the package 100 to determine an addressable memory location in the memory storage array. The signal assignments of the first terminals 104 in the first set 114 can be a mirror image of the signal assignments of the first terminals in the second set 124.
IPC 8 full level
G11C 5/04 (2006.01); G11C 5/06 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01)
CPC (source: EP)
G11C 5/04 (2013.01); G11C 5/063 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/18 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/06156 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73209 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/9202 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3011 (2013.01)
Citation (search report)
See references of WO 2013052324A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2013052320 A1 20130411; WO 2013052320 A4 20130711; EP 2764512 A2 20140813; EP 2764513 A2 20140813; EP 2764513 B1 20170419; JP 2014530507 A 20141117; JP 2015503214 A 20150129; JP 2016195269 A 20161117; JP 5964438 B2 20160803; JP 5966009 B2 20160810; KR 20140073559 A 20140616; KR 20140081856 A 20140701; TW 201320297 A 20130516; TW 201322412 A 20130601; TW 201324708 A 20130616; TW 201639110 A 20161101; TW I520284 B 20160201; TW I527188 B 20160321; TW I546930 B 20160821; WO 2013052321 A2 20130411; WO 2013052321 A3 20131017; WO 2013052324 A2 20130411; WO 2013052324 A3 20131031
DOCDB simple family (application)
US 2012057170 W 20120926; EP 12773455 A 20120926; EP 12791306 A 20120926; JP 2014534599 A 20120926; JP 2014534602 A 20120926; JP 2016132320 A 20160704; KR 20147012058 A 20120926; KR 20147012125 A 20120926; TW 101136575 A 20121003; TW 101136585 A 20121003; TW 101136590 A 20121003; TW 105118512 A 20121003; US 2012057173 W 20120926; US 2012057204 W 20120926