EP 2764541 A1 20140813 - STUB MINIMIZATION FOR ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE
Title (en)
STUB MINIMIZATION FOR ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE
Title (de)
SIMULATORMINIMIERUNG FÜR BAUGRUPPEN OHNE DRAHTBINDUNG AN VERPACKUNGSSUBSTRATE
Title (fr)
RÉDUCTION AU MINIMUM DES STUBS POUR MONTAGES SANS CONNEXION DES FILS AU SUBSTRAT DU BOÎTIER
Publication
Application
Priority
- US 201161542488 P 20111003
- US 201161542553 P 20111003
- US 201261600361 P 20120217
- US 201213439286 A 20120404
- US 2012057554 W 20120927
Abstract (en)
[origin: WO2013052345A1] A microelectronic package (100) can include a substrate (102) and a microelectronic element (130) having a face (134) and one or more columns (138, 139) of contacts (132) exposed thereat which face and are joined to corresponding contacts exposed at a surface (120) of the substrate. An axial plane (140) may intersect the face along a line in a first direction (142) and centered relative to the columns of element contacts (132). Columns (104A, 104B) of package terminals can extend in the first direction. First terminals exposed at a central region (112) of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region (112) may have a width (152) not more than three and one-half times a minimum pitch (150) between the columns of package terminals. The axial plane can intersect the central region.
IPC 8 full level
H01L 23/498 (2006.01); H01L 25/065 (2006.01)
CPC (source: EP)
G11C 5/04 (2013.01); G11C 5/063 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H01L 24/06 (2013.01); H01L 24/19 (2013.01); H01L 25/0657 (2013.01); H01L 22/32 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/06156 (2013.01); H01L 2224/06179 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/06515 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81805 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1435 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/15172 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3011 (2013.01)
Citation (search report)
See references of WO 2013052345A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2013052345 A1 20130411; EP 2764541 A1 20140813; EP 2764542 A2 20140813; JP 2014535165 A 20141225; JP 2015502652 A 20150122; JP 5881833 B2 20160309; JP 5895059 B2 20160330; KR 101840240 B1 20180504; KR 101901218 B1 20181108; KR 20140081857 A 20140701; KR 20140084131 A 20140704; TW 201322416 A 20130601; TW 201324731 A 20130616; TW 201330187 A 20130716; TW I459518 B 20141101; TW I489611 B 20150621; TW I491016 B 20150701; WO 2013052347 A1 20130411; WO 2013052398 A2 20130411; WO 2013052398 A3 20130822
DOCDB simple family (application)
US 2012057554 W 20120927; EP 12778535 A 20120927; EP 12783713 A 20121001; JP 2014534608 A 20120927; JP 2014534620 A 20121001; KR 20147012161 A 20120927; KR 20147012162 A 20121001; TW 101136574 A 20121003; TW 101136589 A 20121003; TW 101136593 A 20121003; US 2012057563 W 20120927; US 2012058229 W 20121001