Global Patent Index - EP 2773040 A4

EP 2773040 A4 20150610 - SURFACE ACOUSTIC WAVE DEVICE

Title (en)

SURFACE ACOUSTIC WAVE DEVICE

Title (de)

OBERFLÄCHENSCHALLWELLENREGELUNG

Title (fr)

DISPOSITIF D'ONDE ACOUSTIQUE DE SURFACE

Publication

EP 2773040 A4 20150610 (EN)

Application

EP 12844374 A 20121022

Priority

  • JP 2011233137 A 20111024
  • JP 2012077243 W 20121022

Abstract (en)

[origin: EP2773040A1] A surface acoustic wave device is provided which can adjust a band width without connecting an additional capacity, and which has a sufficiently small propagation loss. In a surface acoustic wave device (1), a plurality of surface acoustic wave elements (2 and 3) are made of piezoelectric bodies (4) having the same Cut-Angle. In the surface acoustic wave elements (2 and 3), a propagation azimuth (X1) of a surface acoustic wave in at least one surface acoustic wave element (2) is different from a propagation azimuth (X2) of a surface acoustic wave in at least another one surface acoustic wave element (3). In each of the surface acoustic wave elements (2 and 3), a confinement layer (12) for confining the surface acoustic wave inside the piezoelectric body (4) is disposed on the piezoelectric body (4) at the side opposite to the side where an electrode is formed.

IPC 8 full level

H03H 9/25 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/145 (2006.01); H03H 9/64 (2006.01); H10N 30/20 (2023.01); H10N 30/85 (2023.01); H03H 9/00 (2006.01); H03H 9/72 (2006.01)

CPC (source: EP US)

H03H 9/02559 (2013.01 - EP US); H03H 9/02574 (2013.01 - EP US); H03H 9/02622 (2013.01 - EP US); H03H 9/02834 (2013.01 - EP US); H03H 9/02866 (2013.01 - EP US); H03H 9/14594 (2013.01 - EP US); H03H 9/64 (2013.01 - US); H03H 9/6483 (2013.01 - EP US); H03H 9/0042 (2013.01 - EP US); H03H 9/02535 (2013.01 - US); H03H 9/0585 (2013.01 - EP US); H03H 9/175 (2013.01 - EP US); H03H 9/6433 (2013.01 - EP US); H03H 9/725 (2013.01 - EP US)

Citation (search report)

  • [Y] JP 2006121259 A 20060511 - SEIKO EPSON CORP
  • [Y] US 2010207707 A1 20100819 - YATA MASARU [JP]
  • [Y] EP 1903676 A1 20080326 - MURATA MANUFACTURING CO [JP]
  • [Y] US 2007267942 A1 20071122 - MATSUMOTO HISANORI [JP], et al
  • [A] KEN YA HASHIMOTO: "Introduction to Surface Acoustic Wave (SAW) Devices", 1 January 2007 (2007-01-01), XP055186313, Retrieved from the Internet <URL:http://www.te.chiba-u.jp/~ken/lecture/SAW_Intro.pdf> [retrieved on 20150428]
  • [AP] NATALYA NAUMENKO: "Multilayered Structure as a Novel Material for Surface Acoustic Wave Devices: Physical Insight", ACOUSTIC WAVES - FROM MICRODEVICES TO HELIOSEISMOLOGY, 14 November 2011 (2011-11-14), pages 421 - 442, XP055061480, ISBN: 978-9-53-307572-3, Retrieved from the Internet <URL:http://cdn.intechweb.org/pdfs/23420.pdf> [retrieved on 20130430]
  • See also references of WO 2013061926A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2773040 A1 20140903; EP 2773040 A4 20150610; EP 2773040 B1 20171004; CN 103891139 A 20140625; CN 103891139 B 20160824; JP 5720797 B2 20150520; JP WO2013061926 A1 20150402; US 2014225684 A1 20140814; US 9276558 B2 20160301; WO 2013061926 A1 20130502

DOCDB simple family (application)

EP 12844374 A 20121022; CN 201280051904 A 20121022; JP 2012077243 W 20121022; JP 2013540769 A 20121022; US 201414254984 A 20140417