Global Patent Index - EP 2775565 A1

EP 2775565 A1 20140910 - Multi-layer wire structure for high efficiency wireless communication

Title (en)

Multi-layer wire structure for high efficiency wireless communication

Title (de)

Mehrlagige Drahtstruktur für hochwirksame Drahtloskommunikation

Title (fr)

Structure de fil multicouche pour communication sans fil à haut rendement

Publication

EP 2775565 A1 20140910 (EN)

Application

EP 13001130 A 20130306

Priority

EP 13001130 A 20130306

Abstract (en)

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

IPC 8 full level

H01Q 1/36 (2006.01); H01Q 1/38 (2006.01); H01Q 7/00 (2006.01)

CPC (source: EP)

H01Q 1/364 (2013.01); H01Q 1/38 (2013.01); H01Q 7/00 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 2775565 A1 20140910; EP 3579338 A1 20191211

DOCDB simple family (application)

EP 13001130 A 20130306; EP 19188841 A 20130306