Global Patent Index - EP 2779784 A1

EP 2779784 A1 20140917 - Heating plate

Title (en)

Heating plate

Title (de)

Heizplatte

Title (fr)

Plaque de chauffage

Publication

EP 2779784 A1 20140917 (EN)

Application

EP 13159228 A 20130314

Priority

EP 13159228 A 20130314

Abstract (en)

A heating plate includes a thermally conductive, electrically insulating main board (1) on whose surface an electrically-conductive heat-generating circuit (30) and an outer insulating layer are layered. The heat-generating circuit is formed by connecting one first electrically-conductive layer (31) and one second electrically-conductive layer (32) that are arranged in different directions. The first and second electrically-conductive layers (31, 32) are overlapped to form an overlapping area (33). The heat-generating circuit has at least two electrically-conductive segments (34) exposed outside the outer insulating layer. Thereby, when the electrically-conductive segments (34) receive incoming current, the electrically-conductive heat-generating circuit (30) can generate heat rapidly, and the heat can be transmitted to the main board (1) through the thermally-conductive insulating layer. The overlapping area (33) formed at each turning point along the electrically-conductive heat-generating circuit (30) is more capable of load bearing so that the electrically-conductive heat-generating circuit (30) is unlikely to be damaged at the turning point.

IPC 8 full level

H05B 3/28 (2006.01); H05B 3/86 (2006.01)

CPC (source: EP)

H05B 3/28 (2013.01); H05B 3/86 (2013.01); H05B 2203/003 (2013.01); H05B 2203/016 (2013.01)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 2779784 A1 20140917

DOCDB simple family (application)

EP 13159228 A 20130314