EP 2781460 A4 20160316 - RESIN-LABEL-MOUNTING DEVICE, RESIN-LABEL-MOUNTING METHOD, AND RESIN-LABEL-MOUNTED VESSEL
Title (en)
RESIN-LABEL-MOUNTING DEVICE, RESIN-LABEL-MOUNTING METHOD, AND RESIN-LABEL-MOUNTED VESSEL
Title (de)
HARZETIKETTMONTAGEVORRICHTUNG, HARZETIKETTMONTAGEVERFAHREN UND GEFÄSS MIT MONTIERTEM HARZETIKETT
Title (fr)
DISPOSITIF DE MONTAGE D'ÉTIQUETTES EN RÉSINE, PROCÉDÉ DE MONTAGE D'ÉTIQUETTES EN RÉSINE, ET RÉCIPIENT SUR LEQUEL EST MONTÉE UNE ÉTIQUETTE EN RÉSINE
Publication
Application
Priority
- JP 2011248699 A 20111114
- JP 2012077356 W 20121023
Abstract (en)
[origin: EP2781460A1] In the present invention, when forming a tube shape by overlapping the back end portion (2a) of a resin label (2) to the front end portion, the portion of the terminus (2aa) to which glue has not been applied is heated and cured. Glue is applied by means of a glue application means (14) to the back end portion (2a) of the resin label (2) held at a transfer drum (10), and after wrapping around a mandrel (28) and forming a tube shape by overlapping and adhering the back end portion (2a) to the front end portion, the back end portion (2a) including the portion of the terminus (2aa) to which glue has not been applied is heated by means of a heater (176) for a shorter period of time than that at which the resin label (2) welds and at a higher temperature than the heating temperature when causing shrinkage afterwards. The terminus (2aa) at which glue has not been applied of the back end portion (2a) of the resin label (2) is cured, and so there is no curling or deformation, and the appearance as a product is improved.
IPC 8 full level
B65C 3/14 (2006.01); B65B 53/00 (2006.01); B65C 3/16 (2006.01); B65D 25/36 (2006.01)
CPC (source: EP)
B65C 3/065 (2013.01); B65C 9/2217 (2013.01); B65D 23/085 (2013.01); B65B 53/02 (2013.01)
Citation (search report)
- [A] WO 2011061091 A1 20110526 - SACMI VERONA SPA [IT], et al
- [A] WO 9527613 A1 19951019 - GERRO PLAST GMBH [DE], et al
- [A] US 2007169874 A1 20070726 - KONTZ ROBERT F [US]
- See references of WO 2013073348A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2781460 A1 20140924; EP 2781460 A4 20160316; EP 2781460 B1 20180822; JP 2013103739 A 20130530; JP 6003043 B2 20161005; WO 2013073348 A1 20130523
DOCDB simple family (application)
EP 12849181 A 20121023; JP 2011248699 A 20111114; JP 2012077356 W 20121023