EP 2781628 A1 20140924 - PRODUCTION METHOD FOR TRANSFER MOLD, TRANSFER MOLD PRODUCED USING SAME, AND COMPONENT PRODUCED USING SAID TRANSFER MOLD
Title (en)
PRODUCTION METHOD FOR TRANSFER MOLD, TRANSFER MOLD PRODUCED USING SAME, AND COMPONENT PRODUCED USING SAID TRANSFER MOLD
Title (de)
HERSTELLUNGSVERFAHREN FÜR EINE PRESSSPRITZFORM, IN DIESEM VERFAHREN HERGESTELLTE PRESSSPRITZFORM SOWIE UNTER VERWENDUNG DIESER PRESSSPRITZFORM HERGESTELLTE KOMPONENTE
Title (fr)
PROCÉDÉ DE PRODUCTION POUR MOULE À TRANSFERT, MOULE À TRANSFERT PRODUIT À L'AIDE DE CELUI-CI ET COMPOSANT PRODUIT À L'AIDE DUDIT MOULE À TRANSFERT
Publication
Application
Priority
JP 2011006355 W 20111115
Abstract (en)
A transfer mold, which has superior durability and high aspect ratio, for production of a component by electroplating and a component produced thereby are provided. A method therefor includes the steps of: forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate 10, a sidewall of the resist pattern forming a desired angle ±; creating a transfer mold by filing up the resist pattern having the shape of the component by electroplating to a predetermined thickness; and providing a master mold 20 by separating the transfer mold from the metal substrate.
IPC 8 full level
C25D 1/10 (2006.01); C25D 1/00 (2006.01); C25D 1/20 (2006.01); C25D 1/22 (2006.01)
CPC (source: EP US)
C25D 1/00 (2013.01 - EP US); C25D 1/003 (2013.01 - US); C25D 1/10 (2013.01 - EP US); C25D 1/20 (2013.01 - EP US); C25D 1/22 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2781628 A1 20140924; EP 2781628 A4 20150304; CN 104024487 A 20140903; JP 5073878 B1 20121114; JP WO2013072953 A1 20150402; KR 20140092915 A 20140724; TW 201319323 A 20130516; US 2014291157 A1 20141002; WO 2013072953 A1 20130523
DOCDB simple family (application)
EP 11875931 A 20111115; CN 201180074858 A 20111115; JP 2011006355 W 20111115; JP 2012518642 A 20111115; KR 20147016235 A 20111115; TW 101100392 A 20120105; US 201114358300 A 20111115