Global Patent Index - EP 2781628 A4

EP 2781628 A4 20150304 - PRODUCTION METHOD FOR TRANSFER MOLD, TRANSFER MOLD PRODUCED USING SAME, AND COMPONENT PRODUCED USING SAID TRANSFER MOLD

Title (en)

PRODUCTION METHOD FOR TRANSFER MOLD, TRANSFER MOLD PRODUCED USING SAME, AND COMPONENT PRODUCED USING SAID TRANSFER MOLD

Title (de)

HERSTELLUNGSVERFAHREN FÜR EINE PRESSSPRITZFORM, IN DIESEM VERFAHREN HERGESTELLTE PRESSSPRITZFORM SOWIE UNTER VERWENDUNG DIESER PRESSSPRITZFORM HERGESTELLTE KOMPONENTE

Title (fr)

PROCÉDÉ DE PRODUCTION POUR MOULE À TRANSFERT, MOULE À TRANSFERT PRODUIT À L'AIDE DE CELUI-CI ET COMPOSANT PRODUIT À L'AIDE DUDIT MOULE À TRANSFERT

Publication

EP 2781628 A4 20150304 (EN)

Application

EP 11875931 A 20111115

Priority

JP 2011006355 W 20111115

Abstract (en)

[origin: EP2781628A1] A transfer mold, which has superior durability and high aspect ratio, for production of a component by electroplating and a component produced thereby are provided. A method therefor includes the steps of: forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate 10, a sidewall of the resist pattern forming a desired angle ±; creating a transfer mold by filing up the resist pattern having the shape of the component by electroplating to a predetermined thickness; and providing a master mold 20 by separating the transfer mold from the metal substrate.

IPC 8 full level

C25D 1/10 (2006.01); C25D 1/00 (2006.01); C25D 1/20 (2006.01); C25D 1/22 (2006.01)

CPC (source: EP US)

C25D 1/00 (2013.01 - EP US); C25D 1/003 (2013.01 - US); C25D 1/10 (2013.01 - EP US); C25D 1/20 (2013.01 - EP US); C25D 1/22 (2013.01 - EP US)

Citation (search report)

  • [XAY] JP H1050576 A 19980220 - SUMITOMO ELECTRIC INDUSTRIES
  • [Y] JP H01246391 A 19891002 - RICOH KK
  • [YA] JP 2004340661 A 20041202 - YAMAHA CORP
  • [YA] JP 2005335345 A 20051208 - GYOKUTOKU KAGI KOFUN YUGENKOSH
  • [Y] WO 2008130079 A1 20081030 - PARK TAE HEUM [KR], et al
  • [Y] US 2007125654 A1 20070607 - BUCKLEY PAUL W [US], et al
  • [XAY] RYAN TURNER ET AL: "Tapered LIGA HARMs", JOURNAL OF MICROMECHANICS & MICROENGINEERING, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, vol. 13, no. 3, 1 May 2003 (2003-05-01), pages 367 - 372, XP020068911, ISSN: 0960-1317, DOI: 10.1088/0960-1317/13/3/303
  • [XAY] REN YANG ET AL: "Numerical simulation and fabrication of microscale, multilevel, tapered mold inserts using UV-Lithographie, Galvanoformung, Abformung (LIGA) technology", MICROSYSTEM TECHNOLOGIES ; MICRO AND NANOSYSTEMS INFORMATION STORAGE AND PROCESSING SYSTEMS, SPRINGER, BERLIN, DE, vol. 12, no. 6, 1 May 2006 (2006-05-01), pages 545 - 553, XP019349572, ISSN: 1432-1858, DOI: 10.1007/S00542-005-0073-Z
  • [XAY] RYAN ANTHONY TURNER ET AL: "Tapered LIGA mold insert", 1 December 2002 (2002-12-01), XP055160770, Retrieved from the Internet <URL:http://etd.lsu.edu/docs/available/etd-1105102-150556/>
  • See references of WO 2013072953A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2781628 A1 20140924; EP 2781628 A4 20150304; CN 104024487 A 20140903; JP 5073878 B1 20121114; JP WO2013072953 A1 20150402; KR 20140092915 A 20140724; TW 201319323 A 20130516; US 2014291157 A1 20141002; WO 2013072953 A1 20130523

DOCDB simple family (application)

EP 11875931 A 20111115; CN 201180074858 A 20111115; JP 2011006355 W 20111115; JP 2012518642 A 20111115; KR 20147016235 A 20111115; TW 101100392 A 20120105; US 201114358300 A 20111115