EP 2782867 A1 20141001 - CHIP WITH A MICRO-ELECTROMECHANICAL STRUCTURE AND COVERING ELEMENT, AND A METHOD FOR THE PRODUCTION OF SAME
Title (en)
CHIP WITH A MICRO-ELECTROMECHANICAL STRUCTURE AND COVERING ELEMENT, AND A METHOD FOR THE PRODUCTION OF SAME
Title (de)
CHIP MIT MIKRO-ELEKTROMECHANISCHER STRUKTUR UND ABDECKUNGSELEMENT SOWIE VERFAHREN ZU DESSEN HERSTELLUNG
Title (fr)
PUCE À STRUCTURE MICRO-ÉLECTROMÉCANIQUE ET ÉLÉMENT DE RECOUVREMENT, ET PROCÉDÉ POUR SA FABRICATION
Publication
Application
Priority
- DE 102011086765 A 20111122
- EP 2012069072 W 20120927
Abstract (en)
[origin: WO2013075870A1] The invention relates to a micro-electromechanical chip (1) which comprises a substrate (1a), a micro-electromechanical structure (1b) formed in said substrate (1a), and a covering element (3) that is arranged on a surface of this substrate (1a) and that protects said micro-electromechanical structure (1b) from outside contaminants and/or mechanical influences.
IPC 8 full level
B81B 7/00 (2006.01); H04R 1/08 (2006.01); H04R 19/00 (2006.01)
CPC (source: EP US)
B81B 7/0058 (2013.01 - US); B81B 7/0061 (2013.01 - EP US); B81B 7/0077 (2013.01 - US); B81C 1/00269 (2013.01 - US); H04R 17/00 (2013.01 - US); H04R 19/005 (2013.01 - EP US); H04R 31/006 (2013.01 - EP US); B81B 2201/0257 (2013.01 - EP US); H04R 1/04 (2013.01 - EP US); H04R 1/06 (2013.01 - EP US); H04R 1/086 (2013.01 - EP US); H04R 2201/003 (2013.01 - EP US)
Citation (search report)
See references of WO 2013075870A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102011086765 A1 20130523; CN 104093661 A 20141008; EP 2782867 A1 20141001; US 2015086050 A1 20150326; WO 2013075870 A1 20130530
DOCDB simple family (application)
DE 102011086765 A 20111122; CN 201280057350 A 20120927; EP 12775464 A 20120927; EP 2012069072 W 20120927; US 201214357796 A 20120927