EP 2783153 B1 20160824 - COOLING BODY FOR SEMICONDUCTOR LIGHTING DEVICE WITH PLASTICS PARTS
Title (en)
COOLING BODY FOR SEMICONDUCTOR LIGHTING DEVICE WITH PLASTICS PARTS
Title (de)
KÜHLKÖRPER FÜR HALBLEITERLEUCHTVORRICHTUNG MIT KUNSTSTOFFTEILEN
Title (fr)
CORPS DE REFROIDISSEMENT DE DISPOSITIF D'ÉCLAIRAGE À SEMI-CONDUCTEUR COMPRENANT DES PARTIES EN MATIÈRE PLASTIQUE
Publication
Application
Priority
- DE 102011086789 A 20111122
- EP 2012070023 W 20121010
Abstract (en)
[origin: WO2013075880A1] The cooling body (11) is provided for a semiconductor lighting device (H), wherein the cooling body (11) comprises at least: a first plastics part (12), which has a receptacle space (13) open at the rear side; and a second plastics part (14), which is connected to the first plastics part (12) at the front side (15) thereof and is provided for arranging at least one semiconductor light source (22), wherein the first plastics part (12) has a lower thermal conductivity than the second plastics part (14) and at least one insert (18) having a higher thermal conductivity than the second plastics part (14) is present in the cooling body. A semiconductor lighting device comprises such a cooling body (11).
IPC 8 full level
F21V 29/87 (2015.01); F21K 99/00 (2016.01)
CPC (source: EP US)
F21K 9/23 (2016.07 - EP US); F21V 29/87 (2015.01 - EP US); F21Y 2115/10 (2016.07 - EP US)
Citation (examination)
- DE 102010030702 A1 20111013 - OSRAM GMBH [DE]
- DE 102009024904 A1 20101216 - OSRAM GMBH [DE]
- DE 102009022071 A1 20101125 - OSRAM GMBH [DE]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102011086789 A1 20130523; EP 2783153 A1 20141001; EP 2783153 B1 20160824; WO 2013075880 A1 20130530
DOCDB simple family (application)
DE 102011086789 A 20111122; EP 12784475 A 20121010; EP 2012070023 W 20121010