EP 2783395 A1 20141001 - MECHANICAL PACKAGING TECHNIQUE OF ATTACHING MEMS AND FLEX CIRCUIT
Title (en)
MECHANICAL PACKAGING TECHNIQUE OF ATTACHING MEMS AND FLEX CIRCUIT
Title (de)
MECHANISCHE VERPACKUNGSTECHNIK ZUR BEFESTIGUNG VON MEMS- UND FLEXIBLEN SCHALTUNGEN
Title (fr)
TECHNIQUE D'ENCAPSULATION MÉCANIQUE POUR LA CONNEXION DE MICROSYSTÈME ÉLECTROMÉCANIQUE ET DE CIRCUIT SOUPLE
Publication
Application
Priority
- US 201161563455 P 20111123
- US 201213430528 A 20120326
- US 2012063901 W 20121107
Abstract (en)
[origin: WO2013078006A1] The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.
IPC 8 full level
H01L 29/84 (2006.01)
CPC (source: EP)
G01L 19/0084 (2013.01); G01L 23/26 (2013.01); F02D 35/023 (2013.01); F02D 2400/22 (2013.01)
Citation (third parties)
Third party : Jan Reininger
- JP S635232 A 19880111 - NIPPON SOKEN, et al
- JP S6312178 A 19880119 - NIPPON SOKEN, et al
- JP H08261857 A 19961011 - MATSUSHITA ELECTRIC IND CO LTD
- US 2005252299 A1 20051117 - ODA TERUO [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2013078006 A1 20130530; EP 2783395 A1 20141001; EP 2783395 A4 20150902; JP 2015501930 A 20150119; JP 5862991 B2 20160216
DOCDB simple family (application)
US 2012063901 W 20121107; EP 12851847 A 20121107; JP 2014543485 A 20121107