Global Patent Index - EP 2807700 A1

EP 2807700 A1 20141203 - OFFSETTING SHIELDING AND ENHANCING COUPLING IN METALLIZED SMART CARDS

Title (en)

OFFSETTING SHIELDING AND ENHANCING COUPLING IN METALLIZED SMART CARDS

Title (de)

VERSCHIEBUNGSABSCHIRMUNG UND KOPPLUNGSVERSTÄRKUNG IN METALLISIERTEN CHIPKARTEN

Title (fr)

DÉCALAGE DE PROTECTION ET AMÉLIORATION DE COUPLAGE DE CARTES À PUCE MÉTALLISÉES

Publication

EP 2807700 A1 20141203 (EN)

Application

EP 13704726 A 20130123

Priority

  • US 201261589434 P 20120123
  • US 201261619951 P 20120404
  • US 201261624384 P 20120415
  • US 201261693262 P 20120825
  • US 201213600140 A 20120830
  • US 201261697825 P 20120907
  • US 201261732414 P 20121203
  • US 201261737746 P 20121215
  • US 201213730811 A 20121228
  • EP 2013051175 W 20130123

Abstract (en)

[origin: WO2013110625A1] A dual-interface smart card having a booster antenna (BA) with coupler coil (CC) in its card body (CB), and a metallized face plate (202, 302) having a window opening (220, 320) for the antenna module (AM). Performance may be improved by one or more of making the window opening substantially larger than the antenna module, providing perforations through the face plate, disposing ferrite material between the face plate and the booster antenna. Additionally, by one or more of modifying contact pads (CP) on the antenna module (AM), disposing a compensating loop (CL) under the booster antenna, offsetting the antenna module with respect to the coupler coil, arranging the booster antenna as a quasi-dipole, providing the module antenna (MA) with capacitive stubs, and disposing a ferrite element (FE) in the antenna module between the module antenna and the contact pads.

IPC 8 full level

H01Q 1/52 (2006.01); H01Q 1/22 (2006.01)

CPC (source: EP)

H01Q 1/2225 (2013.01); H01Q 1/52 (2013.01); H05K 1/0239 (2013.01); H05K 1/165 (2013.01); H05K 3/103 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/0285 (2013.01)

Citation (search report)

See references of WO 2013110625A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2013110625 A1 20130801; AU 2013211649 A1 20140731; BR 112014018042 A2 20170620; BR 112014018042 A8 20170711; CA 2860909 A1 20130801; CA 2860909 C 20211116; CN 104471791 A 20150325; EP 2807700 A1 20141203; JP 2015513712 A 20150514; KR 20140117614 A 20141007; MX 2014008936 A 20150602

DOCDB simple family (application)

EP 2013051175 W 20130123; AU 2013211649 A 20130123; BR 112014018042 A 20130123; CA 2860909 A 20130123; CN 201380006299 A 20130123; EP 13704726 A 20130123; JP 2014552661 A 20130123; KR 20147023591 A 20130123; MX 2014008936 A 20130123