EP 2810307 A1 20141210 - LOW TEMPERATURE HIGH STRENGTH METAL STACK FOR DIE ATTACHMENT
Title (en)
LOW TEMPERATURE HIGH STRENGTH METAL STACK FOR DIE ATTACHMENT
Title (de)
BEI NIEDRIGER TEMPERATUR HOCHFESTE METALLSTAPEL ZUR CHIPBEFESTIGUNG
Title (fr)
EMPILEMENT EN MÉTAL À HAUTE RÉSISTANCE ET À FAIBLE TEMPÉRATURE POUR FIXATION DE PUCE
Publication
Application
Priority
- US 201213361569 A 20120130
- US 2013023041 W 20130125
Abstract (en)
[origin: WO2013116086A1] A light emitting diode structure includes a diode region and a metal stack on the diode region. The metal stack includes a barrier layer on the diode region and a bonding layer on the barrier layer. The barrier layer is between the bonding layer and the diode region. The bonding layer includes gold, tin and nickel. A weight percentage of tin in the bonding layer is greater than 20 percent and a weight percentage of gold in the bonding layer is less than about 75 percent. A weight percentage of nickel in the bonding layer may be greater than 10 percent.
IPC 8 full level
H01L 33/00 (2010.01)
CPC (source: EP)
H01L 24/13 (2013.01); H01L 24/17 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/641 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83191 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01)
Citation (search report)
See references of WO 2013116086A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DOCDB simple family (application)
US 2013023041 W 20130125; EP 13743107 A 20130125