EP 2810311 A2 20141210 - THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE
Title (en)
THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE
Title (de)
THERMOELEKTRISCHES GENERATORMODUL, METALL-KERAMIK-SUBSTRAT SOWIE VERFAHREN ZUM HERSTELLEN EINES DERARTIGEN METALL-KERAMIK-SUBSTRATES
Title (fr)
MODULE GÉNÉRATEUR THERMOÉLECTRIQUE, SUBSTRAT MÉTAL-CÉRAMIQUE, AINSI QUE PROCÉDÉ DE FABRICATION D'UN SUBSTRAT MÉTAL-CÉRAMIQUE DUDIT TYPE
Publication
Application
Priority
- DE 102012100752 A 20120131
- DE 102012102090 A 20120313
- DE 2013100020 W 20130122
Abstract (en)
[origin: WO2013113311A2] The invention relates to a thermoelectric generator module with a hot zone (1a) and a cold zone (1b) comprising at least a first metal-ceramic substrate (2), which has a first ceramic layer (6) and at least one structured first metallization (4) applied to the first ceramic layer (6) and is assigned to the hot zone, and at least a second metal-ceramic substrate (4), which has a second ceramic layer (7) and at least one structured second metallization (5) applied to the second ceramic layer and is assigned to the cold zone (1b), and also a number of thermoelectric generator components (N, P) located between the first and second structured metallizations (4, 5) of the metal-ceramic substrates (2, 3). Particularly advantageously, the first metal-ceramic substrate (2), assigned to the hot zone (1a), has at least one layer of steel or high-grade steel (8), wherein the first ceramic layer (6) is arranged between the first structured metallization (4) and the at least one layer of steel or high-grade steel (8). The invention also relates to an associated metal-ceramic substrate and to a method for producing it.
IPC 8 full level
H01L 35/32 (2006.01)
CPC (source: EP US)
C04B 37/021 (2013.01 - EP US); C04B 37/026 (2013.01 - EP US); C04B 37/028 (2013.01 - EP US); H05K 1/0306 (2013.01 - US); H05K 1/11 (2013.01 - US); H05K 3/0067 (2013.01 - US); H10N 10/13 (2023.02 - US); H10N 10/17 (2023.02 - EP US); C04B 2237/343 (2013.01 - EP US); C04B 2237/366 (2013.01 - EP US); C04B 2237/368 (2013.01 - EP US); C04B 2237/402 (2013.01 - EP US); C04B 2237/406 (2013.01 - EP US); C04B 2237/407 (2013.01 - EP US); C04B 2237/64 (2013.01 - EP US); C04B 2237/706 (2013.01 - EP US); C04B 2237/86 (2013.01 - EP US); H01L 23/38 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 2201/06 (2013.01 - US); H05K 2201/10219 (2013.01 - US); Y10T 29/49155 (2015.01 - EP US)
Citation (search report)
See references of WO 2013113311A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102012102090 A1 20130801; CN 104106153 A 20141015; EP 2810311 A2 20141210; JP 2015511397 A 20150416; KR 20140123484 A 20141022; US 2014345664 A1 20141127; WO 2013113311 A2 20130808; WO 2013113311 A3 20131003; WO 2013113311 A4 20131128
DOCDB simple family (application)
DE 102012102090 A 20120313; CN 201380007259 A 20130122; DE 2013100020 W 20130122; EP 13705093 A 20130122; JP 2014553617 A 20130122; KR 20147019019 A 20130122; US 201314368372 A 20130122