EP 2811045 B1 20181107 - BASE METAL FOR HIGH-TOUGHNESS CLAD STEEL PLATE GIVING WELD WITH EXCELLENT TOUGHNESS, AND PROCESS FOR PRODUCING SAID CLAD STEEL PLATE
Title (en)
BASE METAL FOR HIGH-TOUGHNESS CLAD STEEL PLATE GIVING WELD WITH EXCELLENT TOUGHNESS, AND PROCESS FOR PRODUCING SAID CLAD STEEL PLATE
Title (de)
BASISMETALL FÜR EINE HOCHZÄHE PLATTIERTE STAHLPLATTE VON HERVORRAGENDER SCHWEISSBESTÄNDIGKEIT SOWIE VERFAHREN ZUR HERSTELLUNG DIESER PLATTIERTEN STAHLPLATTE
Title (fr)
MÉTAL DE BASE POUR UNE PLAQUE D'ACIER PLAQUÉE À HAUTE TÉNACITÉ DONNANT UNE SOUDURE AYANT UNE EXCELLENTE TÉNACITÉ ET PROCÉDÉ DE FABRICATION DE LADITE PLAQUE D'ACIER PLAQUÉE
Publication
Application
Priority
- JP 2012016071 A 20120130
- JP 2012268909 A 20121210
- JP 2013000437 W 20130128
Abstract (en)
[origin: EP2811045A1] The present invention provides a base metal for a high-toughness clad plate having excellent toughness at a welded joint by composite addition of alloy elements. A base metal for high-toughness clad plate having excellent toughness at a welded joint contains, in terms of mass%, C: 0.030 to 0.10%, Si: 0.10 to 0.30%, Mn: 1.00 to 1.60%, P: 0.015% or less, S: 0.003% or less, V: less than 0.010%, and at least one selected from Mo: 0.05 to 0.50%, Nb: 0.010 to 0.060%, Ti: 0.005 to 0.020%, Al: 0.040% or less, Ca: 0.0010 to 0.0040%, and N: 0.0030 to 0.0060%, the balance being Fe and unavoidable impurities, in which a percent ductile fracture is 85% or more in a -20°C DWTT test and vE-20°C is 100 J or more at a HAZ 3 mm position.
IPC 8 full level
B23K 20/04 (2006.01); C21D 9/00 (2006.01); C22C 38/00 (2006.01); C22C 38/14 (2006.01); C22C 38/58 (2006.01)
CPC (source: EP US)
B23K 20/02 (2013.01 - US); B32B 15/01 (2013.01 - US); B32B 15/015 (2013.01 - EP US); C21D 1/18 (2013.01 - EP US); C21D 1/25 (2013.01 - EP US); C21D 8/0205 (2013.01 - EP US); C21D 9/08 (2013.01 - EP US); C22C 19/03 (2013.01 - EP US); C22C 38/00 (2013.01 - EP US); C22C 38/001 (2013.01 - EP US); C22C 38/002 (2013.01 - EP US); C22C 38/02 (2013.01 - EP US); C22C 38/04 (2013.01 - EP US); C22C 38/06 (2013.01 - EP US); C22C 38/08 (2013.01 - EP US); C22C 38/12 (2013.01 - EP US); C22C 38/14 (2013.01 - EP US); C22C 38/16 (2013.01 - EP US); C22C 38/20 (2013.01 - US); C22C 38/22 (2013.01 - US); C22C 38/24 (2013.01 - US); C22C 38/26 (2013.01 - US); C22C 38/28 (2013.01 - US); C22C 38/38 (2013.01 - US); C22C 38/42 (2013.01 - EP US); C22C 38/44 (2013.01 - EP US); C22C 38/46 (2013.01 - EP US); C22C 38/48 (2013.01 - EP US); C22C 38/50 (2013.01 - EP US); C22C 38/58 (2013.01 - EP US); C21D 2251/02 (2013.01 - EP US); C21D 2251/04 (2013.01 - EP US); Y10T 428/12972 (2015.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2811045 A1 20141210; EP 2811045 A4 20150429; EP 2811045 B1 20181107; CN 104080937 A 20141001; CN 104080937 B 20160511; JP 2013177674 A 20130909; JP 5418662 B2 20140219; KR 20140117547 A 20141007; US 2015017476 A1 20150115; WO 2013114851 A1 20130808
DOCDB simple family (application)
EP 13743777 A 20130128; CN 201380007275 A 20130128; JP 2012268909 A 20121210; JP 2013000437 W 20130128; KR 20147022799 A 20130128; US 201314375508 A 20130128