EP 2815462 B1 20180808 - DEVICE FOR CONTACTING A PRINTED CIRCUIT
Title (en)
DEVICE FOR CONTACTING A PRINTED CIRCUIT
Title (de)
VORRICHTUNG ZUR KONTAKTIERUNG EINER LEITERPLATTE
Title (fr)
DISPOSITIF POUR CONTACTER UN CIRCUIT IMPRIMÉ
Publication
Application
Priority
- DE 202012001645 U 20120217
- EP 2013000214 W 20130124
Abstract (en)
[origin: CA2876631A1] The invention relates to a device for contacting a circuit board (18), comprising one or more contact elements (14), an intake into which at least one section of the circuit board (18) can be inserted, means for moving the circuit board (18) relative to the contact elements (14) until the contact elements (14) are contacted, and means for fixing the circuit board in the position in which the contact elements (14) are contacted.
IPC 8 full level
H01R 12/81 (2011.01); H01R 11/24 (2006.01); H01R 12/77 (2011.01)
CPC (source: EP US)
H01R 4/48 (2013.01 - US); H01R 12/81 (2013.01 - EP US); H01R 12/83 (2013.01 - US); H01R 13/64 (2013.01 - US); H01R 11/24 (2013.01 - EP US); H01R 12/774 (2013.01 - EP US); H01R 2201/20 (2013.01 - EP US)
Citation (examination)
EP 0131410 A2 19850116 - TOKYO TATSUNO KK [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 202012001645 U1 20130521; CA 2876631 A1 20130822; CA 2876631 C 20180410; CN 104115336 A 20141022; CN 104115336 B 20170222; EP 2815462 A1 20141224; EP 2815462 B1 20180808; HK 1201993 A1 20150911; JP 2015507341 A 20150305; JP 6254537 B2 20171227; KR 101901743 B1 20180928; KR 20140125442 A 20141028; TW M462374 U 20130921; US 2015024619 A1 20150122; US 9240643 B2 20160119; WO 2013120580 A1 20130822
DOCDB simple family (application)
DE 202012001645 U 20120217; CA 2876631 A 20130124; CN 201380009752 A 20130124; EP 13702340 A 20130124; EP 2013000214 W 20130124; HK 15102439 A 20150310; JP 2014556943 A 20130124; KR 20147026013 A 20130124; TW 102203123 U 20130218; US 201314379033 A 20130124