EP 2815463 A1 20141224 - CONTACT ASSEMBLY FOR AN ELECTRICAL CONNECTOR
Title (en)
CONTACT ASSEMBLY FOR AN ELECTRICAL CONNECTOR
Title (de)
KONTAKTANORDNUNG FÜR EINEN ELEKTRISCHEN VERBINDER
Title (fr)
ENSEMBLE CONTACT POUR CONNECTEUR ÉLECTRIQUE
Publication
Application
Priority
- US 201213399528 A 20120217
- US 2013023760 W 20130130
Abstract (en)
[origin: WO2013122740A1] A contact assembly (102) includes a conductive substrate (202), a composite layer (204), and a conductive layer (206). The conductive substrate (202) is configured to form a conductive path of the electrical connector (100). The composite layer (204) is engaged to the conductive substrate (202) and includes a dielectric material (514) with a conductive filler material (508) dispersed within the dielectric material at a concentration that is lower than a percolation threshold concentration (708) of the composite layer. The conductive layer (206) is engaged to the composite layer (204). The conductive substrate (202), the composite layer (204), and the conductive layer (206) form a capacitive element through which a signal propagation path (402) between the conductive substrate (202) and a mating contact (400) that mates with the conductive layer (206) passes.
IPC 8 full level
H01R 13/03 (2006.01); H01R 4/58 (2006.01); H01R 13/658 (2011.01)
CPC (source: EP)
H01B 1/22 (2013.01); H01B 1/24 (2013.01); H01R 13/035 (2013.01); H01R 13/7197 (2013.01); H01R 4/58 (2013.01); H01R 13/6464 (2013.01); H01R 13/6599 (2013.01); H01R 43/16 (2013.01)
Citation (search report)
See references of WO 2013122740A1
Citation (examination)
US 2011006393 A1 20110113 - CUI JI [US]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2013122740 A1 20130822; CN 104247159 A 20141224; CN 104247159 B 20180209; EP 2815463 A1 20141224; JP 2015507347 A 20150305; JP 6339942 B2 20180606
DOCDB simple family (application)
US 2013023760 W 20130130; CN 201380020587 A 20130130; EP 13703497 A 20130130; JP 2014557670 A 20130130