EP 2816411 A1 20141224 - Immersion exposure method and apparatus, and method for producing a device
Title (en)
Immersion exposure method and apparatus, and method for producing a device
Title (de)
Immersionsbelichtungsverfahren und -vorrichtung, und Verfahren zur Herstellung einer Vorrichtung
Title (fr)
Procédé et appareil d'exposition par immersion, et méthode de fabrication d'un dispositif
Publication
Application
Priority
- JP 2003146424 A 20030523
- EP 04734603 A 20040524
Abstract (en)
When exposing a substrate (P) by projecting a pattern image onto the substrate via a projection optical system (PL) and liquid (1), an exposure method includes a determination of a liquid immersion condition to be performed to the substrate, such as a liquid type, depending on a film (SP) formed as a liquid contact surface of the substrate. The liquid type is selected by switching between a first liquid supply section (11) and a third liquid supply section (21). It is possible to smoothly perform immersion exposure for the substrate (P) on which a different photo-resist layer is provided.
IPC 8 full level
G03F 7/20 (2006.01)
CPC (source: EP KR US)
G03B 27/42 (2013.01 - US); G03F 7/2041 (2013.01 - KR US); G03F 7/2053 (2013.01 - KR); G03F 7/70258 (2013.01 - KR); G03F 7/70325 (2013.01 - US); G03F 7/70341 (2013.01 - EP KR US); G03F 7/70725 (2013.01 - US); G03F 7/70775 (2013.01 - US); G03F 7/70833 (2013.01 - KR); G03F 7/70866 (2013.01 - KR); H01L 21/0273 (2013.01 - KR); H01L 21/0274 (2013.01 - KR)
Citation (applicant)
- WO 9949504 A1 19990930 - NIKON CORP [JP], et al
- JP H10163099 A 19980619 - NIKON CORP
- JP H10214783 A 19980811 - NIKON CORP
- US 6341007 B1 20020122 - NISHI KENJI [JP], et al
- US 6400441 B1 20020604 - NISHI KENJI [JP], et al
- US 6549269 B1 20030415 - NISHI KENJI [JP], et al
- US 6590634 B1 20030708 - NISHI KENJI [JP], et al
- JP 2000505958 A 20000516
- US 5969441 A 19991019 - LOOPSTRA ERIK R [NL], et al
- US 6208407 B1 20010327 - LOOPSTRA ERIK R [NL]
- US 5623853 A 19970429 - NOVAK W THOMAS [US], et al
- US 5528118 A 19960618 - LEE MARTIN E [US]
- JP H08166475 A 19960625 - NIKON CORP
- US 5874820 A 19990223 - LEE MARTIN E [US]
- JP H08330224 A 19961213 - NIKON CORP
Citation (search report)
- [AD] WO 9949504 A1 19990930 - NIKON CORP [JP], et al
- [A] JP H04305915 A 19921028 - NIKON CORP
- [E] EP 1571698 A1 20050907 - NIKON CORP [JP]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
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DOCDB simple family (application)
EP 04734603 A 20040524; EP 14179111 A 20040524; EP 14179112 A 20040524; EP 16158672 A 20040524; EP 17189837 A 20040524; EP 18163314 A 20040524; HK 15104725 A 20150518; HK 15105699 A 20150616; HK 16112559 A 20161101; HK 18105273 A 20180423; HK 18113100 A 20181012; JP 2004007415 W 20040524; JP 2010108698 A 20100510; JP 2010108738 A 20100510; JP 2012210090 A 20120924; JP 2013083820 A 20130412; JP 2013242938 A 20131125; JP 2014132785 A 20140627; JP 2015007528 A 20150119; JP 2015120109 A 20150615; JP 2016003686 A 20160112; JP 2016217693 A 20161108; KR 20057022145 A 20040524; KR 20117016819 A 20040524; KR 20127010587 A 20040524; KR 20137006891 A 20040524; KR 20137016409 A 20040524; KR 20137030195 A 20040524; KR 20137031353 A 20040524; KR 20147017521 A 20040524; KR 20157011154 A 20040524; KR 20167000800 A 20040524; KR 20177004805 A 20040524; KR 20187014459 A 20040524; TW 100126336 A 20040521; TW 102126874 A 20040521; TW 102126875 A 20040521; TW 102136490 A 20040521; TW 102142613 A 20040521; TW 103146232 A 20040521; TW 104112367 A 20040521; TW 104112370 A 20040521; TW 93114402 A 20040521; US 201313897989 A 20130520; US 201313898011 A 20130520; US 201615141465 A 20160428; US 201615141528 A 20160428; US 201815897271 A 20180215; US 22202808 A 20080731; US 22202908 A 20080731; US 28372405 A 20051122; US 69818607 A 20070126