Global Patent Index - EP 2816878 A4

EP 2816878 A4 20151007 - WIRING BOARD

Title (en)

WIRING BOARD

Title (de)

LEITERPLATTE

Title (fr)

CARTE DE CÂBLAGE

Publication

EP 2816878 A4 (EN)

Application

EP 13790895 A

Priority

  • JP 2012112015 A
  • JP 2013002423 W

Abstract (en)

[origin: EP2816878A1] To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member.

IPC 8 full level

H05K 3/34 (2006.01); H01L 23/12 (2006.01); H01L 23/498 (2006.01); H05K 3/28 (2006.01)

CPC (source: EP KR US)

H01L 23/12 (2013.01 - KR); H01L 23/49811 (2013.01 - EP US); H05K 1/0213 (2013.01 - KR US); H05K 3/28 (2013.01 - KR); H05K 3/34 (2013.01 - KR); H05K 3/3452 (2013.01 - EP US); H01L 23/49816 (2013.01 - EP US); H01L 23/49822 (2013.01 - EP US); H01L 23/49827 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 1/111 (2013.01 - EP US); H05K 3/244 (2013.01 - EP US); H05K 3/28 (2013.01 - EP US); H05K 2201/09881 (2013.01 - EP US); H05K 2201/099 (2013.01 - EP US); H05K 2203/0571 (2013.01 - EP US); H05K 2203/0588 (2013.01 - EP US)

C-Set (source: EP US)

  1. H01L 2924/0002 + H01L 2924/00012
  2. H01L 2924/0002 + H01L 2924/00

 

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2816878 A1 20141224; EP 2816878 A4 20151007; CN 104206034 A 20141210; CN 104206034 B 20180206; JP 2013239603 A 20131128; JP 5341227 B1 20131113; KR 101555460 B1 20150923; KR 20150008150 A 20150121; TW 201404268 A 20140116; TW I599292 B 20170911; US 2015027750 A1 20150129; US 9560739 B2 20170131; WO 2013171964 A1 20131121

DOCDB simple family (application)

EP 13790895 A 20130410; CN 201380017541 A 20130410; JP 2012112015 A 20120516; JP 2013002423 W 20130410; KR 20147033170 A 20130410; TW 102116876 A 20130513; US 201314376744 A 20130410