EP 2817586 A4 20160217 - SCANNING DEPTH ENGINE
Title (en)
SCANNING DEPTH ENGINE
Title (de)
3D-ABTASTMASCHINE
Title (fr)
DISPOSITIF DE BALAYAGE TRIDIMENSIONNEL
Publication
Application
Priority
- US 201261598921 P 20120215
- IB 2013051189 W 20130214
Abstract (en)
[origin: US2013206967A1] An optoelectronic module includes a micro-optical substrate and a beam transmitter, including a laser die mounted on the micro-optical substrate and configured to emit at least one laser beam along a beam axis. A receiver includes a detector die mounted on the micro-optical substrate and configured to sense light received by the module along a collection axis of the receiver. Beam-combining optics are configured to direct the laser beam and the received light so that the beam axis is aligned with the collection axis outside the module.
IPC 8 full level
G01S 7/481 (2006.01); G01B 11/10 (2006.01); G01B 11/22 (2006.01); G01S 7/4865 (2020.01); G01S 17/10 (2020.01); G01S 17/42 (2006.01); G01S 17/89 (2020.01); H01S 5/022 (2006.01)
CPC (source: EP KR US)
B23K 26/073 (2013.01 - US); B23P 19/04 (2013.01 - US); G01J 1/0411 (2013.01 - US); G01J 1/44 (2013.01 - US); G01S 7/4812 (2013.01 - EP KR US); G01S 7/4817 (2013.01 - EP KR US); G01S 7/4865 (2013.01 - US); G01S 7/4868 (2013.01 - EP KR US); G01S 17/10 (2013.01 - EP KR US); G01S 17/42 (2013.01 - EP KR US); G01S 17/89 (2013.01 - EP US); G01S 17/894 (2020.01 - KR); G02B 1/041 (2013.01 - US); G02B 27/0961 (2013.01 - US); G06F 3/011 (2013.01 - US); G06T 15/00 (2013.01 - US); H01S 3/0071 (2013.01 - US); H01S 5/02253 (2021.01 - EP US); H01S 5/02325 (2021.01 - EP US); H01S 5/18388 (2013.01 - US); H01S 5/4012 (2013.01 - EP KR US); H01S 5/4075 (2013.01 - US); H01S 5/4081 (2013.01 - US); H01S 5/423 (2013.01 - EP KR US); G01J 2001/4466 (2013.01 - US); H01S 5/02257 (2021.01 - EP US); Y10T 29/49002 (2015.01 - EP US)
Citation (search report)
- [XAY] US 2006176468 A1 20060810 - ANDERSON NOEL W [US], et al
- [XYI] US 2011228251 A1 20110922 - YEE DAWSON [US], et al
- [Y] US 2008218832 A1 20080911 - MIZOGUCHI YASUSHI [JP]
- [Y] US 2004105139 A1 20040603 - HIROSE FUTOSHI [JP], et al
- [A] WO 2009107922 A1 20090903 - SAMSUNG ELECTRONICS CO LTD [KR]
- [Y] US 5701326 A 19971223 - FLOWERS EDWARD MAX [US]
- See references of WO 2013121366A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 2013206967 A1 20130815; US 9157790 B2 20151013; AU 2013219966 A1 20140724; AU 2013219966 A8 20140814; AU 2013219966 B2 20150402; CN 104160240 A 20141119; CN 104160240 B 20170222; EP 2817586 A1 20141231; EP 2817586 A4 20160217; EP 2817586 B1 20200325; IL 233337 A0 20140831; IL 233337 B 20180731; JP 2015514965 A 20150521; JP 2016224058 A 20161228; JP 5985661 B2 20160906; JP 6367273 B2 20180801; KR 101709844 B1 20170223; KR 20140138724 A 20141204; TW 201341852 A 20131016; TW I537603 B 20160611; US 10261578 B2 20190416; US 11703940 B2 20230718; US 2013207970 A1 20130815; US 2015377696 A1 20151231; US 2017205873 A1 20170720; US 2018120931 A1 20180503; US 2019196579 A1 20190627; US 2020371585 A1 20201126; US 9651417 B2 20170516; US 9746369 B2 20170829; US 9898074 B2 20180220; WO 2013121366 A1 20130822
DOCDB simple family (application)
US 201313766811 A 20130214; AU 2013219966 A 20130214; CN 201380007623 A 20130214; EP 13748754 A 20130214; IB 2013051189 W 20130214; IL 23333714 A 20140623; JP 2014557150 A 20130214; JP 2016152724 A 20160803; KR 20147025753 A 20130214; TW 102105535 A 20130218; US 201313766801 A 20130214; US 201514846856 A 20150907; US 201715473653 A 20170330; US 201715844651 A 20171218; US 201916292367 A 20190305; US 202016989904 A 20200811