EP 2818579 A1 20141231 - METAL MATERIAL, AND SURFACE TREATMENT METHOD AND DEVICE
Title (en)
METAL MATERIAL, AND SURFACE TREATMENT METHOD AND DEVICE
Title (de)
METALLMATERIAL UND OBERFLÄCHENBEHANDLUNGSVERFAHREN SOWIE VORRICHTUNG
Title (fr)
MATÉRIAU EN MÉTAL, PROCÉDÉ ET DISPOSITIF DE TRAITEMENT DE SURFACE
Publication
Application
Priority
- JP 2012038553 A 20120224
- JP 2012038555 A 20120224
- JP 2012038557 A 20120224
- JP 2013054413 W 20130221
Abstract (en)
A metallic material includes a metal substrate 2 and a modified layer formed on the surface of the metal substrate 2. The modified layer includes three or more protrusions in an area of 10 µm 2 on average protruding from the surface of the metal substrate 2. The protrusions have an average diameter of 1 µm or less when viewed in a direction perpendicular to the surface of the metal substrate. The modified layer may include one or more protrusions in an area of 10 µm 2 on average including a base part protruding from the surface of the metal substrate 2 and a tip part formed on the end of the base part, the protrusions having an average diameter of 1 µm or less when viewed in a direction perpendicular to the surface of the metal substrate 2 and a constricted structure with the outer diameter of the base part being smaller than the outer diameter of the tip part, thereby providing a metallic material having new functions such as hydrophilic properties and luminescence properties.
IPC 8 full level
C23C 26/00 (2006.01); B23H 1/00 (2006.01); C25D 3/02 (2006.01); C25D 5/02 (2006.01)
CPC (source: EP)
C25F 3/06 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2818579 A1 20141231; EP 2818579 A4 20151111; CN 104114747 A 20141022; IN 1697KON2014 A 20151023; JP 5817907 B2 20151118; JP WO2013125658 A1 20150730; KR 101687462 B1 20161216; KR 20140112559 A 20140923; TW 201341176 A 20131016; TW I472424 B 20150211; WO 2013125658 A1 20130829
DOCDB simple family (application)
EP 13752521 A 20130221; CN 201380009686 A 20130221; IN 1697KON2014 A 20140814; JP 2013054413 W 20130221; JP 2014500933 A 20130221; KR 20147022776 A 20130221; TW 102106374 A 20130223