EP 2820388 A1 20150107 - INFRARED SENSOR, THERMAL CAMERA AND METHOD FOR PRODUCING A MICROSTRUCTURE OF THERMOELECTRIC SENSOR PILLARS
Title (en)
INFRARED SENSOR, THERMAL CAMERA AND METHOD FOR PRODUCING A MICROSTRUCTURE OF THERMOELECTRIC SENSOR PILLARS
Title (de)
INFRAROTSENSOR, WÄRMEBILDKAMERA UND VERFAHREN ZUM HERSTELLEN EINER MIKROSTRUKTUR AUS THERMOELEKTRISCHEN SENSORSTÄBEN
Title (fr)
CAPTEUR INFRAROUGE, CAMERA THERMIQUE A PROCEDE DE FABRICATION D'UN MICROSTRUCTURE DE CAPTEURS THERMOELECTRIQUES EN FORME DE TIGE
Publication
Application
Priority
- DE 102012203792 A 20120312
- EP 2013052662 W 20130211
Abstract (en)
[origin: WO2013135447A1] The invention relates to an infrared sensor (10) with a microstructure comprising a multiplicity of sensor rods (12) protruding from a sensor base (16) and arranged axially parallel to one another, wherein each of the sensor rods (12) is designed as a thermocouple, in that a first rod end (32), arranged on the sensor base (16), is electrically connected to an opposite free second rod end (34) by both a first and a second electrically conductive rod element, wherein the two rod elements (26, 28) have a different Seebeck coefficient, and wherein the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base (16).
IPC 8 full level
G01J 5/12 (2006.01); G01J 5/02 (2006.01); H01L 35/32 (2006.01); H01L 35/34 (2006.01)
CPC (source: EP US)
G01J 5/02 (2013.01 - US); G01J 5/023 (2013.01 - EP US); G01J 5/12 (2013.01 - EP US); H10N 10/00 (2023.02 - EP US); H10N 10/01 (2023.02 - EP US); H10N 10/17 (2023.02 - EP US); G01J 2005/123 (2013.01 - US); Y10T 29/49201 (2015.01 - EP US)
Citation (search report)
See references of WO 2013135447A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102012203792 A1 20130912; EP 2820388 A1 20150107; US 2015048249 A1 20150219; US 9887339 B2 20180206; WO 2013135447 A1 20130919
DOCDB simple family (application)
DE 102012203792 A 20120312; EP 13705134 A 20130211; EP 2013052662 W 20130211; US 201314384993 A 20130211