EP 2823077 B1 20160406 - COPPER-NICKEL-ZINC ALLOY CONTAINING SILICON
Title (en)
COPPER-NICKEL-ZINC ALLOY CONTAINING SILICON
Title (de)
SILIZIUMHALTIGE KUPFER-NICKEL-ZINK-LEGIERUNG
Title (fr)
ALLIAGE DE CUIVRE-NICKEL-ZINC CONTENANT DU SILICIUM
Publication
Application
Priority
- DE 102012004725 A 20120307
- EP 2013000373 W 20130208
Abstract (en)
[origin: WO2013131604A2] The invention includes a copper-nickel-zinc alloy with the following composition in weight %: Cu 47.0 to 49.0%, Ni 8.0 to 10.0%, Mn 0.2 to 0.6%, Si 0.05 to 0.4%, Pb 1.0 to 1.5%, Fe and/or Co up to 0.8%, the rest being Zn and unavoidable impurities, wherein the total of the Fe content and double the Co content is at least 0.1 weight % and wherein mixing silicides containing nickel, iron and manganese and/or containing nickel, cobalt and manganese are stored as spherical or ellipsoidal particles in a structure consisting of an alpha- and ß-phase. The invention further relates to a method for producing semi-finished products from a copper-nickel-zinc alloy.
IPC 8 full level
C22C 9/04 (2006.01); C22C 30/02 (2006.01); C22C 30/06 (2006.01); C22F 1/08 (2006.01)
CPC (source: EP US)
B22D 11/001 (2013.01 - EP US); B22D 11/004 (2013.01 - EP US); B22D 11/005 (2013.01 - EP US); C21D 7/02 (2013.01 - EP US); C21D 9/04 (2013.01 - EP US); C21D 9/52 (2013.01 - EP US); C22C 9/04 (2013.01 - EP US); C22C 30/02 (2013.01 - EP US); C22C 30/04 (2013.01 - EP US); C22C 30/06 (2013.01 - EP US); C22F 1/002 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US); B21C 37/04 (2013.01 - US); B21K 1/44 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102012004725 A1 20130912; DE 102012004725 B4 20180719; EP 2823077 A2 20150114; EP 2823077 B1 20160406; JP 2015514863 A 20150521; JP 5850590 B2 20160203; MX 2014009958 A 20150717; MX 363002 B 20190301; MY 171496 A 20191015; US 2015041028 A1 20150212; US 2017016097 A1 20170119; US 9617629 B2 20170411; US 9738961 B2 20170822; WO 2013131604 A2 20130912; WO 2013131604 A3 20140710
DOCDB simple family (application)
DE 102012004725 A 20120307; EP 13704005 A 20130208; EP 2013000373 W 20130208; JP 2014559120 A 20130208; MX 2014009958 A 20130208; MY PI2015700247 A 20130208; US 201314383261 A 20130208; US 201615278448 A 20160928