EP 2823084 A1 20150114 - METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS
Title (en)
METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS
Title (de)
VERFAHREN ZUR FÖRDERUNG DER HAFTUNG ZWISCHEN DIELEKTRISCHEN SUBSTRATEN UND METALLSCHICHTEN
Title (fr)
PROCÉDÉ PERMETTANT DE FAVORISER L'ADHÉRENCE ENTRE DES SUBSTRATS DIÉLECTRIQUES ET DES COUCHES MÉTALLIQUES
Publication
Application
Priority
- EP 12075036 A 20120329
- EP 2013055901 W 20130321
- EP 13710864 A 20130321
Abstract (en)
[origin: EP2644744A1] The present invention relates to novel processes for metallization of dielectric substrate surfaces applying organosilane compositions followed by oxidative treatment. The method results in metal plated surfaces exhibiting high adhesion between the substrate and the plated metal while at the same time leaves the smooth substrate surface intact.
IPC 8 full level
C23C 18/20 (2006.01)
CPC (source: EP US)
C23C 18/1641 (2013.01 - US); C23C 18/1653 (2013.01 - EP US); C23C 18/1675 (2013.01 - US); C23C 18/2006 (2013.01 - EP US); C23C 18/22 (2013.01 - US); C23C 18/24 (2013.01 - EP US); C23C 18/28 (2013.01 - US); C23C 18/285 (2013.01 - EP US); C23C 18/30 (2013.01 - EP US); C23C 18/36 (2013.01 - EP US); C23C 18/38 (2013.01 - US); C23C 18/40 (2013.01 - EP US); C23C 18/405 (2013.01 - EP US); C25D 5/022 (2013.01 - EP US); C25D 5/56 (2013.01 - EP US); C25D 3/18 (2013.01 - EP US); C25D 3/38 (2013.01 - EP US)
Citation (search report)
See references of WO 2013143961A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2644744 A1 20131002; EP 2823084 A1 20150114; EP 2823084 B1 20150819; JP 2015516509 A 20150611; JP 6234429 B2 20171122; KR 101927679 B1 20181211; KR 20140143764 A 20141217; TW 201352102 A 20131216; TW I569704 B 20170201; US 2015050422 A1 20150219; WO 2013143961 A1 20131003
DOCDB simple family (application)
EP 12075036 A 20120329; EP 13710864 A 20130321; EP 2013055901 W 20130321; JP 2015502219 A 20130321; KR 20147027285 A 20130321; TW 102111595 A 20130329; US 201314385779 A 20130321