Global Patent Index - EP 2832446 A4

EP 2832446 A4 20151209 - HONEYCOMB STRUCTURE

Title (en)

HONEYCOMB STRUCTURE

Title (de)

WABENSTRUKTUR

Title (fr)

STRUCTURE EN NID D'ABEILLES

Publication

EP 2832446 A4 20151209 (EN)

Application

EP 13767695 A 20130327

Priority

  • JP 2012081840 A 20120330
  • JP 2013059145 W 20130327

Abstract (en)

[origin: EP2832446A1] The object and a problem to be solved of the present invention are to provide a honeycomb structure that is a catalyst carrier, also functions as a heater when a voltage is applied to allow controlling a deviation in a temperature distribution when the voltage is applied, and has an excellent thermal shock resistance. A honeycomb structure (100) of the present invention includes a honeycomb structure body (4) and a pair of electrode members (21). The pair of electrode members (21) are arranged at a side surface (5) of the honeycomb structure body (4). The honeycomb structure body (4) has an electrical resistivity of 1 to 200 ©cm. The respective pair of electrode members (21) are formed into a band-like shape extending in a direction in which the cells of the honeycomb structure body (4) extend. In a cross section perpendicular to the cell extending direction, one of the electrode members (21) is arranged opposite to another of the electrode members (21) sandwiching a center of the honeycomb structure body (4). One or more of slits (6) are formed at the honeycomb structure body (4). The slit (6) is open to a side surface (5). At least the one slit (6) is formed so as not to intersect with a straight line connecting center portions of the respective pair of electrode members (21) in the cross section perpendicular to the cell extending direction.

IPC 8 full level

B01J 35/00 (2006.01); B01D 53/86 (2006.01); B01J 32/00 (2006.01); B01J 35/02 (2006.01); B01J 35/04 (2006.01); F01N 3/022 (2006.01); F01N 3/027 (2006.01); F01N 3/20 (2006.01); F01N 3/28 (2006.01)

CPC (source: EP US)

B01D 53/8678 (2013.01 - US); B01J 35/56 (2024.01 - EP US); F01N 3/0222 (2013.01 - EP US); F01N 3/2026 (2013.01 - EP US); F01N 3/2828 (2013.01 - EP US); B01D 2255/806 (2013.01 - US); B01D 2255/90 (2013.01 - US); B01J 35/33 (2024.01 - EP US); F01N 3/027 (2013.01 - EP US); F01N 2240/16 (2013.01 - EP US); F01N 2260/10 (2013.01 - EP US); F01N 2330/06 (2013.01 - EP US); Y02T 10/12 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2832446 A1 20150204; EP 2832446 A4 20151209; EP 2832446 B1 20170315; CN 104245133 A 20141224; CN 104245133 B 20160824; JP 5997259 B2 20160928; JP WO2013146955 A1 20151214; US 2015030510 A1 20150129; US 9707515 B2 20170718; WO 2013146955 A1 20131003

DOCDB simple family (application)

EP 13767695 A 20130327; CN 201380018510 A 20130327; JP 2013059145 W 20130327; JP 2014507991 A 20130327; US 201414496738 A 20140925