EP 2845454 A1 20150311 - METHOD FOR PRODUCING CERAMIC CIRCUIT BOARDS FROM CERAMIC SUBSTRATES HAVING METAL-FILLED VIAS
Title (en)
METHOD FOR PRODUCING CERAMIC CIRCUIT BOARDS FROM CERAMIC SUBSTRATES HAVING METAL-FILLED VIAS
Title (de)
VERFAHREN ZUM HERSTELLEN KERAMISCHER LEITERPLATTEN AUS KERAMIKSUBSTRATEN MIT METALLGEFÜLLTEN VIAS
Title (fr)
PROCÉDÉ POUR FABRIQUER DES CARTES DE CIRCUIT IMPRIMÉ CÉRAMIQUES À PARTIR DE SUBSTRATS CÉRAMIQUES COMPRENANT DES VIAS REMPLIS DE MÉTAL
Publication
Application
Priority
- DE 102012207283 A 20120502
- EP 2013059012 W 20130430
Abstract (en)
[origin: WO2013164348A1] The invention relates to a method for producing ceramic circuit boards from ceramic substrates having metal-filled vias. In order to be able to fill the vias by means of a single filling process, either a planar copper metallization is applied on one side to the ceramic substrate having vias by means of screen printing, or a copper film of 100 - 300 mum is bonded on one side to the ceramic substrate having vias in a DCB/DBC process and the vias are filled from the ceramic side by means of an electrogalvanic process in a copper bath by the deposition of copper.
IPC 8 full level
CPC (source: CN EP US)
H05K 1/0306 (2013.01 - CN EP US); H05K 1/115 (2013.01 - US); H05K 3/027 (2013.01 - US); H05K 3/241 (2013.01 - US); H05K 3/425 (2013.01 - CN EP US); H05K 3/043 (2013.01 - EP US); H05K 3/108 (2013.01 - CN EP US); H05K 2201/09563 (2013.01 - CN EP US); H05K 2203/0723 (2013.01 - CN EP US); H05K 2203/0733 (2013.01 - CN EP US)
Citation (search report)
See references of WO 2013164348A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102013207942 A1 20131107; CN 104412720 A 20150311; EP 2845454 A1 20150311; JP 2015520944 A 20150723; JP 6231079 B2 20171115; TW 201410085 A 20140301; US 2015108003 A1 20150423; WO 2013164348 A1 20131107
DOCDB simple family (application)
DE 102013207942 A 20130430; CN 201380023208 A 20130430; EP 13721642 A 20130430; EP 2013059012 W 20130430; JP 2015509420 A 20130430; TW 102114943 A 20130426; US 201314397675 A 20130430