Title (en)

Ultrahigh-purity copper bonding wire

Title (de)

Ultrahochreiner Kupferbonddraht

Title (fr)

Fil de liaison comprenant un cuivre de pureté extrêmement élevée

Publication

EP 2845915 A1 20150311 (EN)

Application

EP 14188802 A 20060424

Priority

• JP 2005174896 A 20050615
• EP 06745599 A 20060424

Abstract (en)

Provided is ultrahigh purity copper having a hardness of 40Hv or less, and a purity of 8N or higher (provided that this excludes the gas components of O, C, N, H, S and P). With this ultrahigh purity copper, the respective elements of O, S and P as gas components are 1wtppm or less. Also provided is a manufacturing method of ultrahigh purity copper based on two-step electrolysis using an electrolytic solution comprised of copper nitrate solution, including the procedures of adding hydrochloric acid in an electrolytic solution comprised of copper nitrate solution; circulating the electrolytic solution; and performing two-step electrolysis while eliminating impurities with a filter upon temporarily setting the circulating electrolytic solution to a temperature of 10°C or less. The present invention provides a copper material that is compatible with the thinning (wire drawing) of the above, and is capable of efficiently manufacturing ultrahigh purity copper having a purity of 8N (99.999999wt%) or higher, providing the obtained ultrahigh purity copper, and providing a bonding wire for use in a semiconductor element that can be thinned.

IPC 8 full level

C22C 9/00 (2006.01); C22B 15/14 (2006.01); C25C 1/12 (2006.01); C25C 7/06 (2006.01); H01L 21/60 (2006.01)

CPC (source: EP KR US)

C22B 15/0084 (2013.01 - EP US); C22B 15/0089 (2013.01 - EP US); C22C 9/00 (2013.01 - EP KR US); C25C 1/12 (2013.01 - EP KR US); C25C 7/06 (2013.01 - EP KR US); H01L 24/43 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); C22B 15/0073 (2013.01 - EP US); H01L 2224/05624 (2013.01 - EP US); H01L 2224/43 (2013.01 - EP US); H01L 2224/43848 (2013.01 - EP US); H01L 2224/45015 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/45147 (2013.01 - EP US); H01L 2224/45565 (2013.01 - EP US); H01L 2224/456 (2013.01 - EP US); H01L 2224/48624 (2013.01 - EP US); H01L 2924/00011 (2013.01 - EP US); H01L 2924/01105 (2013.01 - EP US); H01L 2924/01208 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); Y02P 10/20 (2015.11 - EP US)

C-Set (source: EP US)

1. H01L 2224/45147 + H01L 2924/01008
2. H01L 2224/48624 + H01L 2924/00
3. H01L 2224/45144 + H01L 2924/00015
4. H01L 2224/45147 + H01L 2924/013 + H01L 2924/00
5. H01L 2224/45015 + H01L 2924/00
6. H01L 2224/43848 + H01L 2924/20105
7. H01L 2224/43848 + H01L 2924/20106
8. H01L 2224/43848 + H01L 2924/20107
9. H01L 2224/43848 + H01L 2924/2011
10. H01L 2224/43848 + H01L 2924/20111
11. H01L 2924/00011 + H01L 2924/01033
12. H01L 2224/45147 + H01L 2924/01015
13. H01L 2224/45147 + H01L 2924/01001
14. H01L 2224/45147 + H01L 2924/01006
15. H01L 2224/45147 + H01L 2924/01007
16. H01L 2224/45147 + H01L 2924/01016
17. H01L 2224/45147 + H01L 2924/01205
18. H01L 2924/01046 + H01L 2924/00011
19. H01L 2224/05624 + H01L 2924/00014
20. H01L 2224/45565 + H01L 2224/45147 + H01L 2224/45647
21. H01L 2224/45147 + H01L 2924/01208
22. H01L 2224/48824 + H01L 2924/00

Citation (applicant)

• JP S61251062 A 19861108 - NIPPON MINING CO
• JP S61255045 A 19861112 - NIPPON MINING CO
• JP S62104061 A 19870514 - TATSUTA DENSEN KK, et al
• JP S6220858 A 19870129 - HITACHI LTD
• JP S6222469 A 19870130 - MITSUBISHI METAL CORP
• JP S6289348 A 19870423 - HITACHI CABLE
• JP S62127436 A 19870609 - NIPPON MINING CO, et al
• JP S62216238 A 19870922 - TATSUTA DENSEN KK, et al
• JP S62127438 A 19870609 - NIPPON MINING CO, et al
• JP S633424 A 19880108 - TATSUTA DENSEN KK, et al
• JP S6356924 A 19880311 - MITSUBISHI ELECTRIC CORP
• JP S6372858 A 19880402 - TATSUTA DENSEN KK
• JP S63236338 A 19881003 - HITACHI CABLE
• JP H03291340 A 19911220 - MITSUBISHI MATERIALS CORP
• JP H04247630 A 19920903 - HITACHI CABLE
• JP 2003174057 A 20030620 - NAKAJIMA HIDEO, et al
• PRACTICAL APPLICATION TECHNOLOGY OF COPPER WIRE BONDING, 1989, pages 77 - 80
• "Development of Copper Bonding Wire", ELECTRONICS SPECIAL FEATURE, January 1991 (1991-01-01), pages 53 - 56

Citation (search report)

• [XP] WO 2005073434 A1 20050811 - NIKKO MATERIALS CO LTD [JP], et al
• [X] JP H02185990 A 19900720 - DOWA MINING CO

Designated contracting state (EPC)

DE FR

DOCDB simple family (publication)

EP 1903119 A1 20080326; EP 1903119 A4 20140618; EP 1903119 B1 20150923; CN 100567532 C 20091209; CN 101198711 A 20080611; EP 2845915 A1 20150311; JP 4750112 B2 20110817; JP WO2006134724 A1 20090108; KR 101006035 B1 20110106; KR 20080017369 A 20080226; KR 20100087780 A 20100805; TW 200643192 A 20061216; TW I315349 B 20091001; US 2009272466 A1 20091105; WO 2006134724 A1 20061221

DOCDB simple family (application)

EP 06745599 A 20060424; CN 200680021649 A 20060424; EP 14188802 A 20060424; JP 2006308521 W 20060424; JP 2007521216 A 20060424; KR 20077029379 A 20060424; KR 20107015909 A 20060424; TW 95117439 A 20060517; US 91562806 A 20060424