EP 2849185 A1 20150318 - CONTACT MATERIALS FOR USE IN ON-BOARD HIGH-VOLTAGE DIRECT-CURRENT SYSTEMS
Title (en)
CONTACT MATERIALS FOR USE IN ON-BOARD HIGH-VOLTAGE DIRECT-CURRENT SYSTEMS
Title (de)
KONTAKTWERKSTOFFE FÜR HOCHSPANNUNGS- GLEICHSTROMBORDSYSTEME
Title (fr)
MATERIAUX DE CONTACT POUR UTILISATION DANS DES SYSTEMES DE HAUTE TENSION ET COURANT CONTINUE EMBARQUÉS
Publication
Application
Priority
DE 102013014915 A 20130911
Abstract (en)
[origin: US2015069020A1] A contact element for high voltage direct current switches includes a matrix made of a first material selected from the group comprising copper, silver, palladium, platinum, tungsten, molybdenum, rhenium, nickel, gold, and alloys thereof. The contact element also includes a foreign phase, which is dispersed in the matrix and is made of a second material selected from the group comprising carbon, tin(II) oxide, tin(IV) oxide, zinc(II) oxide, tungsten, nickel and mixtures thereof. The contact element has a porosity of ≰1.0% by volume, based on a total volume of the contact element.
Abstract (de)
Die vorliegende Erfindung betrifft ein Kontaktelement für Hochspannungs-Gleichstromschalter, ein Verfahren zur Herstellung eines solchen Kontaktelements sowie die Verwendung des Kontaktelements in einem Hochspannungs-Gleichstromschalter.
IPC 8 full level
H01B 1/02 (2006.01); C23C 4/08 (2006.01); H01H 1/02 (2006.01); H01H 1/0237 (2006.01); H01H 1/025 (2006.01); H01H 11/04 (2006.01); H01H 33/59 (2006.01); H05H 1/36 (2006.01)
CPC (source: EP US)
H01B 1/02 (2013.01 - EP US); H01H 1/02372 (2013.01 - EP US); H01H 1/025 (2013.01 - EP US); H01H 11/048 (2013.01 - EP US); H01H 33/10 (2013.01 - US); C23C 4/08 (2013.01 - US); H01H 2001/0208 (2013.01 - EP US); H01H 2201/024 (2013.01 - US); H01H 2201/026 (2013.01 - US); H01H 2201/03 (2013.01 - US); H01H 2239/044 (2013.01 - US); H01H 2300/036 (2013.01 - EP US)
Citation (search report)
- [A] US 4452651 A 19840605 - SHIBATA AKIRA [JP]
- [A] GB 2123033 A 19840125 - CHUGAI ELECTRIC IND CO LTD
- [A] US 4131458 A 19781226 - SATOH MITSUNORI, et al
- [XAI] LU WANG ET AL: "A New Silver-Based Graded Composite as Electrical Contact Material", KEY ENGINEERING MATERIALS, vol. 336-338, 1 January 2007 (2007-01-01), pages 2616 - 2618, XP055165744, DOI: 10.4028/www.scientific.net/KEM.336-338.2616
- [XAI] F.L. MIGUEL ET AL: "Electroless deposition of a Ag matrix on semiconducting one-dimensional nanostructures", THIN SOLID FILMS, vol. 536, 2 April 2013 (2013-04-02), pages 54 - 56, XP055165650, ISSN: 0040-6090, DOI: 10.1016/j.tsf.2013.03.054
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2849185 A1 20150318; EP 2849185 B1 20161207; DE 102013014915 A1 20150312; US 2015069020 A1 20150312
DOCDB simple family (application)
EP 14002972 A 20140828; DE 102013014915 A 20130911; US 201414482873 A 20140910