EP 2853140 B1 20200729 - INTERCONNECTION SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
Title (en)
INTERCONNECTION SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
Title (de)
VERBINDUNGSSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG DAVON
Title (fr)
SUBSTRAT D'INTERCONNEXION ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
IB 2012001596 W 20120521
Abstract (en)
[origin: WO2013175261A1] The invention relates to an interconnection substrate for electronic components and a method for manufacturing the same. The interconnection substrate comprises rows and columns of connecting units (300). These connecting units (300) are electrically connected with an array of first (16), second (17) and third (18) connection traces designed so as to allow, without changing the electrical pattern of the interconnection substrate, a subsequent manufacturing of sets of connecting units (300) with various numbers of connecting units (300).
IPC 8 full level
H05K 1/02 (2006.01)
CPC (source: EP)
H05K 1/0287 (2013.01); H05K 3/242 (2013.01); H05K 3/4092 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/0397 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/175 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2013175261 A1 20131128; EP 2853140 A1 20150401; EP 2853140 B1 20200729
DOCDB simple family (application)
IB 2012001596 W 20120521; EP 12761806 A 20120521