Global Patent Index - EP 2856574 B1

EP 2856574 B1 20171101 - ELECTRONIC/ELECTRICAL CONNECTING ARRANGEMENT

Title (en)

ELECTRONIC/ELECTRICAL CONNECTING ARRANGEMENT

Title (de)

ELEKTRONISCHE/ELEKTRISCHE VERBINDUNGSANORDNUNG

Title (fr)

ENSEMBLE DE CONNEXION ÉLECTRONIQUE/ÉLECTRIQUE

Publication

EP 2856574 B1 20171101 (DE)

Application

EP 13718501 A 20130413

Priority

  • DE 202012005335 U 20120531
  • EP 2013001090 W 20130413

Abstract (en)

[origin: WO2013178309A1] The invention relates to an electronic/electrical connecting arrangement (2) with a first housing part (28) and a second housing part (30), which can be brought along an assembly axis (M1) into a connecting position in which they form a first connection contour (41), which is connectable to the first contacting element (4), and a second connection contour (50). A connecting conductor (22) is received in the housing of the connecting element (8), the connecting conductor having first contacting means (24) on the first connection contour (41) that can be brought into electrical/electronic contact with the first conductor (10) in a first contact plane (KE1), and second contacting means (26) on the second connection contour (50) that can be brought into electrical/electronic contact with the second conductor (20) in a second contact plane (KE2) different from the first contact plane (KE1).

IPC 8 full level

H01R 4/24 (2006.01); H01R 31/06 (2006.01); H01R 43/20 (2006.01); H01R 43/26 (2006.01)

CPC (source: EP US)

H01R 4/242 (2013.01 - EP US); H01R 31/06 (2013.01 - EP US); H01R 43/20 (2013.01 - US); H01R 43/26 (2013.01 - US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

DE 202012005335 U1 20120712; EP 2856574 A1 20150408; EP 2856574 B1 20171101; ES 2653242 T3 20180206; JP 2015521351 A 20150727; JP 6254156 B2 20171227; US 2015303631 A1 20151022; US 9350129 B2 20160524; WO 2013178309 A1 20131205

DOCDB simple family (application)

DE 202012005335 U 20120531; EP 13718501 A 20130413; EP 2013001090 W 20130413; ES 13718501 T 20130413; JP 2015514371 A 20130413; US 201314404653 A 20130413