Global Patent Index - EP 2857187 B1

EP 2857187 B1 20160120 - Device and method for producing embossed cover elements for packaging

Title (en)

Device and method for producing embossed cover elements for packaging

Title (de)

Vorrichtung und Verfahren zur Herstellung von geprägten Klappen oder Etiketten für Verpackungen

Title (fr)

Dispositif et procédé de fabrication de couvercles en relief ou étiquettes pour emballage

Publication

EP 2857187 B1 20160120 (EN)

Application

EP 14183225 A 20140902

Priority

  • EP 13187151 A 20131002
  • EP 14183225 A 20140902

Abstract (en)

[origin: EP2857187A1] Device for producing embossed cover elements for emballages, which cover elements are embossed in and die-cut from a pseudo-endless sheet material which runs through the device in a longitudinal direction at temporary standstill of the sheet material, the device comprising at least one M (M‰¥1) die-cutting tools and M x N (N‰¥2) embossing tools, wherein N different embossing tools are combined with each die-cutting tool in the longitudinal direction.

IPC 8 full level

B31D 1/00 (2006.01); B31F 1/07 (2006.01); B65B 7/01 (2006.01); B65B 41/18 (2006.01)

CPC (source: EP)

B31D 1/0018 (2013.01); B31F 1/07 (2013.01); B65B 7/01 (2013.01); B65B 41/18 (2013.01); B31F 2201/0733 (2013.01); B31F 2201/0741 (2013.01); B31F 2201/0756 (2013.01); B31F 2201/0758 (2013.01); B65B 7/164 (2013.01); B65B 61/025 (2013.01)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2857187 A1 20150408; EP 2857187 B1 20160120; HR P20160409 T1 20160617; PL 2857187 T3 20160930; RS 54714 B1 20160831

DOCDB simple family (application)

EP 14183225 A 20140902; HR P20160409 T 20160419; PL 14183225 T 20140902; RS P20160245 A 20140902