EP 2867831 B1 20200715 - METHODE POUR LA FABRICATION D'UN MICROCIRCUIT SANS CONTACT
Title (en)
METHODE POUR LA FABRICATION D'UN MICROCIRCUIT SANS CONTACT
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES KONTAKTLOSEN MIKROCHIPS
Title (fr)
PROCÉDÉ DE FABRICATION D'UN MICROCIRCUIT SANS CONTACT
Publication
Application
Priority
- FR 1201866 A 20120702
- FR 2013050982 W 20130503
Abstract (en)
[origin: WO2014006286A1] The invention relates to a method for the production of a contactless microcircuit antenna coil, comprising steps consisting in: depositing a first electrically conductive layer (AL) on a first face of a card, and forming a spiral antenna coil (MA1) in the first layer, said coil comprising multiple turns including an inner turn (IS) connected to an inner connection pad (ACT2) and an outer turn (ES) connected to an outer connection pad (ACT1). The outer turn (ES) extends along the entire contour of the antenna coil except in one area in order to allow the passage of a conductive track connecting the outer connection pad (ACT1) to the outer turn. The outer and inner connection pads (ACT1, ACT2) of the antenna coil (MA1) are formed in a central zone (CZ) of the outer turn. The antenna coil comprises a bypass zone (CST1) in which each turn bypasses the outer connection pad.
IPC 8 full level
G06K 19/077 (2006.01)
CPC (source: EP US)
G06K 19/07749 (2013.01 - EP US); G06K 19/07754 (2013.01 - EP US); G06K 19/07773 (2013.01 - EP US); G06K 19/07775 (2013.01 - US); G06K 19/07783 (2013.01 - US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48228 (2013.01 - EP US); Y10T 29/49016 (2015.01 - EP US); Y10T 29/49018 (2015.01 - EP US)
C-Set (source: EP US)
Citation (opposition)
Opponent : SMART PACKAGING SOLUTIONS
- FR 1201866 A 20120702
- WO 2014006286 A1 20140109 - INSIDE SECURE [FR]
- WO 9807191 A1 19980219 - SIEMENS AG [DE], et al
- WO 2007026077 A1 20070308 - SMART PACKAGING SOLUTIONS SPS [FR], et al
- EP 2907084 A1 20150819 - SMART PACKAGING SOLUTIONS SPS [FR]
- WO 9726621 A1 19970724 - GEMPLUS CARD INT [FR], et al
- US 2008283615 A1 20081120 - FINN DAVID [IE]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
FR 2992761 A1 20140103; FR 2992761 B1 20150529; BR 112014032959 A2 20170627; BR 112014032959 B1 20211013; CN 104603798 A 20150506; CN 104603798 B 20180504; EP 2867831 A1 20150506; EP 2867831 B1 20200715; US 2015186769 A1 20150702; US 9218562 B2 20151222; WO 2014006286 A1 20140109
DOCDB simple family (application)
FR 1201866 A 20120702; BR 112014032959 A 20130503; CN 201380044934 A 20130503; EP 13725722 A 20130503; FR 2013050982 W 20130503; US 201314412491 A 20130503