EP 2868775 A3 20150812 - Plating bath and method
Title (en)
Plating bath and method
Title (de)
Galvanisierungsbad und -verfahren
Title (fr)
Procédé et bain de placage
Publication
Application
Priority
US 201314071677 A 20131105
Abstract (en)
[origin: EP2868775A2] Tin-containing electroplating baths having a combination of certain brightening agents provide tin-containing solder deposits having reduced void formation and smooth morphology.
IPC 8 full level
C25D 3/32 (2006.01); C25D 3/60 (2006.01); C25D 7/12 (2006.01)
CPC (source: CN EP US)
C25D 3/32 (2013.01 - CN EP US); C25D 3/60 (2013.01 - EP US); C25D 7/12 (2013.01 - CN EP US); C25D 7/123 (2013.01 - CN EP US)
Citation (search report)
- [X] US 5061351 A 19911029 - COMMANDER JOHN H [US], et al
- [X] US 2011189848 A1 20110804 - EWERT INGO [DE], et al
- [AD] US 4582576 A 19860415 - OPASKAR VINCE [US], et al
- [XI] JP 4362568 B2 20091111
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2868775 A2 20150506; EP 2868775 A3 20150812; CN 104674312 A 20150603; JP 2015092021 A 20150514; KR 20150051926 A 20150513; TW 201533278 A 20150901; US 2015122661 A1 20150507
DOCDB simple family (application)
EP 14191882 A 20141105; CN 201410858388 A 20141105; JP 2014224805 A 20141105; KR 20140153138 A 20141105; TW 103138319 A 20141105; US 201314071677 A 20131105