EP 2869053 A1 20150506 - Integrated lamellae extraction station
Title (en)
Integrated lamellae extraction station
Title (de)
Integrierte Lamellenextraktionsstation
Title (fr)
Station d'extraction de lamelles intégrée
Publication
Application
Priority
US 201314066782 A 20131030
Abstract (en)
An integrated station for extracting specimens suitable for viewing by a transmission electron microscope from a patterned semiconductor wafer, including a wafer cassette holder; a wafer transfer device; a nanomachining device, including a scanning electron microscope and a focused ion beam, a vacuum load lock and an operator control device, and wherein the operator control device notes locations of created lamellae; a plucker device; a control computer, adapted to control the wafer transfer device and the plucker device, commanding the plucker device to remover lamellae at the locations noted by the operator control device; and a user monitor and data input device, communicatively coupled to the computer. The wafer transfer device can transfer wafers from the wafer cassette holder to the vacuum load lock; from the vacuum load lock to the plucker device and from the plucker device to the wafer cassette holder.
IPC 8 full level
CPC (source: EP US)
B26D 7/18 (2013.01 - EP US); G01N 1/286 (2013.01 - EP US); G01N 1/32 (2013.01 - EP US); H01J 2237/204 (2013.01 - EP US); H01J 2237/208 (2013.01 - EP US); H01J 2237/31745 (2013.01 - EP US); Y10T 83/0467 (2015.04 - EP US); Y10T 83/2074 (2015.04 - EP US)
Citation (applicant)
- US 6268608 B1 20010731 - CHANDLER CLIVE D [US]
- US 8357913 B2 20130122 - AGORIO ENRIQUE [US], et al
Citation (search report)
- [XDI] WO 2008051880 A2 20080502 - FEI CO [US], et al
- [A] EP 1512956 A2 20050309 - FEI CO [US]
- [A] US 2012119084 A1 20120517 - SHAAPUR FREDERICK F [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2869053 A1 20150506; CN 104597290 A 20150506; CN 104597290 B 20200214; JP 2015092156 A 20150514; JP 6522921 B2 20190529; US 2015114193 A1 20150430; US 9821486 B2 20171121
DOCDB simple family (application)
EP 14190566 A 20141028; CN 201410590107 A 20141029; JP 2014217882 A 20141026; US 201314066782 A 20131030