EP 2870620 B1 20161207 - WAFER AND METHOD FOR PRODUCING WAFERS HAVING SURFACE STRUCTURES
Title (en)
WAFER AND METHOD FOR PRODUCING WAFERS HAVING SURFACE STRUCTURES
Title (de)
WAFER UND VERFAHREN ZUR HERSTELLUNG VON WAFERN MIT OBERFLÄCHENSTRUKTUREN
Title (fr)
PLAQUETTE ET PROCÉDÉ DE FABRICATION DE PLAQUETTES MUNIES DE STRUCTURES DE SURFACE
Publication
Application
Priority
- DE 102012013539 A 20120706
- EP 2013002009 W 20130708
Abstract (en)
[origin: WO2014005726A1] The invention relates to a wafer, the starting material (4) of which is a material of low ductility, which has at least one exposed surface. At least one prefabricated application layer (1) having freely selectable material properties is applied to the exposed surface of the starting material (4), thus forming a composite structure. The composite structure is subjected to an inner and/or outer stress field such that along an inner plane, the starting material (4) is split, thus forming the wafer. The wafer is provided with relief-like surface structures at the resulting gap area having substantially predefinable patterns, which can be varied by way of the properties of the starting material.
IPC 8 full level
H01L 31/036 (2006.01)
CPC (source: CN EP)
H01L 21/02 (2013.01 - CN); H01L 21/304 (2013.01 - CN); H01L 31/036 (2013.01 - EP); H01L 31/18 (2013.01 - CN); H01L 21/02002 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102012013539 A1 20140109; CN 104685606 A 20150603; CN 104685606 B 20180615; EP 2870620 A1 20150513; EP 2870620 B1 20161207; WO 2014005726 A1 20140109
DOCDB simple family (application)
DE 102012013539 A 20120706; CN 201380046611 A 20130708; EP 13736485 A 20130708; EP 2013002009 W 20130708