EP 2871008 B1 20190313 - Method and assembly for the production of semi-finished copper and method and device for applying a finishing
Title (en)
Method and assembly for the production of semi-finished copper and method and device for applying a finishing
Title (de)
Verfahren und Anlage zur Herstellung von Kupferhalbzeug sowie Verfahren und Vorrichtung zum Auftragen einer Schlichte
Title (fr)
Procédé et installation de fabrication d'un demi-produit en cuivre, ainsi que procédé et dispositif d'application d'une pâte d'encollage
Publication
Application
Priority
DE 102013015640 A 20130923
Abstract (en)
[origin: US2015083599A1] In a method for the production of semi-finished copper products, first copper is melted and cast to produce copper anodes, in one casting procedure, within multiple ingot molds, subsequently copper cathodes are formed by electrolysis, using at least one of the copper anodes, and then these copper cathodes are processed further to produce semi-finished copper products. A long-term coating is applied to at least one of the ingot molds as a wash, a sulfur-free wash is applied to the ingot mold and/or part of the work pieces cast in the ingot molds is directly processed further to produce semi-finished copper products. A method and an apparatus applies a wash to an ingot mold and a system produces semi-finished copper products.
IPC 8 full level
B22C 3/00 (2006.01); B22D 25/04 (2006.01)
CPC (source: EP US)
B05B 3/00 (2013.01 - US); B05D 1/02 (2013.01 - US); B05D 3/0254 (2013.01 - US); B22C 3/00 (2013.01 - EP US); B22C 23/02 (2013.01 - EP US); B22D 5/02 (2013.01 - EP US); B22D 25/04 (2013.01 - EP US); C25D 1/00 (2013.01 - US); C25D 17/02 (2013.01 - US); C25D 17/10 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 2015083599 A1 20150326; US 9994965 B2 20180612; EP 2871008 A2 20150513; EP 2871008 A3 20151007; EP 2871008 B1 20190313; ES 2726182 T3 20191002; PL 2871008 T3 20190930; RU 2014138161 A 20160410; RU 2614508 C2 20170328
DOCDB simple family (application)
US 201414492253 A 20140922; EP 14400044 A 20140922; ES 14400044 T 20140922; PL 14400044 T 20140922; RU 2014138161 A 20140922