EP 2872821 B1 20200115 - MODULE ASSEMBLY HAVING PIVOTABLE SEMICONDUCTOR MODULES FOR A HEADLAMP
Title (en)
MODULE ASSEMBLY HAVING PIVOTABLE SEMICONDUCTOR MODULES FOR A HEADLAMP
Title (de)
MODULBAUGRUPPE MIT VERSCHWENKBAREN HALBLEITERMODULEN FÜR EINEN SCHEINWERFER
Title (fr)
ENSEMBLE MODULAIRE COMPORTANT DES MODULES À SEMI-CONDUCTEUR PIVOTANTS POUR UN PHARE
Publication
Application
Priority
- DE 102012106314 A 20120713
- EP 2013063757 W 20130629
Abstract (en)
[origin: WO2014009185A1] The invention relates to a module assembly (1) for a headlamp, comprising at least one semiconductor light module (10), and a method for adjusting the semiconductor light module (10), which is accommodated on a support frame (11), wherein the semiconductor light module (10) comprises a heat sink (12) having at least one semiconductor light source (13) accommodated on the heat sink (12). According to the invention, the support frame (11) has at least one ball socket (14), in which the semiconductor light module (10) having the heat sink (12) sits such as to be pivotable about a ball socket center point (15) and in which ball socket the semiconductor light module can be pivoted.
IPC 8 full level
F21S 41/19 (2018.01); F21S 41/141 (2018.01); F21S 45/47 (2018.01); F21S 45/49 (2018.01)
CPC (source: CN EP US)
F21S 41/141 (2017.12 - CN); F21S 41/151 (2017.12 - EP US); F21S 41/19 (2017.12 - EP US); F21S 41/192 (2017.12 - CN EP US); F21S 45/48 (2017.12 - EP US); F21S 45/49 (2017.12 - EP US); Y10T 29/49826 (2015.01 - EP US)
Citation (examination)
- WO 2011032616 A1 20110324 - HIRSCHMANN GMBH [DE], et al
- JP 2005071786 A 20050317 - KOITO MFG CO LTD, et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2014009185 A1 20140116; CN 104428584 A 20150318; CN 104428584 B 20170308; DE 102012106314 A1 20140116; EP 2872821 A1 20150520; EP 2872821 B1 20200115; US 2015204499 A1 20150723; US 9638382 B2 20170502
DOCDB simple family (application)
EP 2013063757 W 20130629; CN 201380037005 A 20130629; DE 102012106314 A 20120713; EP 13732540 A 20130629; US 201314413673 A 20130629