EP 2873093 A1 20150520 - DEVICE FOR ELECTRICALLY TESTING THE INTERCONNECTIONS OF A MICROELECTRONIC DEVICE
Title (en)
DEVICE FOR ELECTRICALLY TESTING THE INTERCONNECTIONS OF A MICROELECTRONIC DEVICE
Title (de)
VORRICHTUNG ZUR ELEKTRISCHEN PRÜFUNG VON VERBINDUNGEN EINER MIKROELEKTRONISCHEN VORRICHTUNG
Title (fr)
DISPOSITIF DE TEST ELECTRIQUE D'INTERCONNEXIONS D'UN DISPOSITIF MICROELECTRONIQUE
Publication
Application
Priority
- FR 1256689 A 20120711
- EP 2013064677 W 20130711
Abstract (en)
[origin: WO2014009470A1] The present application provides a device for the simultaneous electrical testing of TSV interconnection elements (107) passing through a substrate (100), comprising one end connected to a integrated testing circuit and another end that has a removable connection means (115) assembled to the substrate by means of an anisotropic conductive adhesive.
IPC 8 full level
H01L 21/66 (2006.01)
CPC (source: EP US)
G01R 1/20 (2013.01 - US); G01R 31/2853 (2013.01 - EP US); H01L 22/14 (2013.01 - EP US); H01L 22/34 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
See references of WO 2014009470A1
Citation (examination)
US 2010295600 A1 20101125 - KIM JONGHAE [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2014009470 A1 20140116; EP 2873093 A1 20150520; FR 2993396 A1 20140117; FR 2993396 B1 20150515; US 2015115973 A1 20150430; US 9784786 B2 20171010
DOCDB simple family (application)
EP 2013064677 W 20130711; EP 13736567 A 20130711; FR 1256689 A 20120711; US 201314399302 A 20130711