Global Patent Index - EP 2873475 A1

EP 2873475 A1 20150520 - Method of manufacturing wires of Cu-Ag alloys

Title (en)

Method of manufacturing wires of Cu-Ag alloys

Title (de)

Verfahren zur Herstellung von Drähten aus Cu-Ag-Legierungen

Title (fr)

Procédé de fabrication de fils d'alliages Cu-Ag

Publication

EP 2873475 A1 20150520 (EN)

Application

EP 14461523 A 20140404

Priority

PL 40344313 A 20130405

Abstract (en)

A method of manufacturing wires, including microwires, of Cu-Ag alloys, in particular of alloys of Cu-(3÷7.9)% Ag by weight, consisting in that the materials in the form of high chemical purity copper and silver are melted at a temperature of 1083÷1300 C in a graphite crucible placed in a furnace, and subsequently continuously cast at a temperature of 1083÷1300 C, in an inert gas atmosphere, using a graphite mould, at primary cooling conditions (mould cooling) and secondary cooling conditions (the solidified alloy after leaving the mould). Thus obtained casting is subjected to the thermo-mechanical treatment.

IPC 8 full level

B22D 11/00 (2006.01); B22D 11/04 (2006.01); B22D 11/041 (2006.01)

CPC (source: EP)

B22D 1/002 (2013.01); B22D 11/004 (2013.01); B22D 11/005 (2013.01); B22D 11/04 (2013.01); B22D 11/059 (2013.01); B22D 11/1245 (2013.01); C22F 1/08 (2013.01)

Citation (applicant)

Citation (search report)

  • [XD] JP 2000199042 A 20000718 - SHOWA ELECTRIC WIRE & CABLE CO
  • [XD] US 2008202648 A1 20080828 - AOYAGI TAIKAN [JP], et al
  • [X] JP 2000239766 A 20000905 - SUMITOMO ELECTRIC INDUSTRIES, et al
  • [ID] WO 2007046378 A1 20070426 - NAT INST FOR MATERIALS SCIENCE [JP], et al
  • [I] US 7544886 B2 20090609 - DETIAN HUANG [JP], et al
  • [I] US 5077005 A 19911231 - KATO MASANORI [JP]
  • [X] A KAWECKI ET AL: "Fabrication, Properties and Microstructures of High Strength and High Conductivity Copper-Silver Wires / Otrzymywanie Oraz Wlasnosci I Mikrostruktura Wysokowytrzymalych I Wysoko Przewodzacych Drutow Ze Stopow Cu-Ag", ARCHIVES OF METALLURGY AND MATERIALS, 1 December 2012 (2012-12-01), Warsaw, pages 1261, XP055182007, Retrieved from the Internet <URL:http://search.proquest.com/docview/1328783897> [retrieved on 20150410], DOI: 10.2478/v10172-012-0141-1
  • [I] SAKAI ET AL: "Ultra-high strength, high conductivity Cu-Ag alloy wires", ACTA MATERIALIA, ELSEVIER, OXFORD, GB, vol. 45, no. 3, 1 March 1997 (1997-03-01), pages 1017 - 1023, XP005009839, ISSN: 1359-6454

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 2873475 A1 20150520; EP 2873475 B1 20181017; ES 2706474 T3 20190329; HU E041639 T2 20190528; LT 2873475 T 20190325; PL 221274 B1 20160331; PL 2873475 T3 20190430; PL 403443 A1 20141013; SI 2873475 T1 20190531

DOCDB simple family (application)

EP 14461523 A 20140404; ES 14461523 T 20140404; HU E14461523 A 20140404; LT 14461523 T 20140404; PL 14461523 T 20140404; PL 40344313 A 20130405; SI 201431053 T 20140404