EP 2873934 A4 20160217 - HEAT-PUMP-TYPE HEATING DEVICE
Title (en)
HEAT-PUMP-TYPE HEATING DEVICE
Title (de)
ERWÄRMUNGSVORRICHTUNG MIT EINER WÄRMEPUMPE
Title (fr)
DISPOSITIF CHAUFFANT DE TYPE POMPE À CHALEUR
Publication
Application
Priority
- JP 2012154621 A 20120710
- JP 2013068515 W 20130705
Abstract (en)
[origin: EP2873934A1] A heat pump type heating device includes: an indoor side heat exchanger (26); an outdoor side heat exchanger (27); low-pressure side compressor (31) and high-pressure side compressor (32) sequentially compressing refrigerant sent from the outdoor side heat exchanger (27); a first decompression device (36) decompressing the refrigerant sent from the indoor side heat exchanger (26); a gas-liquid separator (38) separating the refrigerant sent from the first decompression device (36), into a gas phase and a liquid phase; a second decompression device (37) connected to a liquid phase side of the gas-liquid separator (38) and decompressing the refrigerant sent from the gas-liquid separator (38); an injection pipe path (51) connected to a gas phase side of the gas-liquid separator (38) and guiding the refrigerant sent from the gas-liquid separator (38), to between the low-pressure side compressor (31) and the high-pressure side compressor (32); and a control unit (46) controlling a decompression ratio of the refrigerant in the second decompression device (37) such that the refrigerant flowing in the injection pipe path (51) is brought into a gas-liquid two-phase state. With such a configuration, there can be provided a heat pump type heating device having a simple configuration and having sufficiently improved heating ability.
IPC 8 full level
F25B 1/10 (2006.01); F25B 1/00 (2006.01); F25B 31/00 (2006.01)
CPC (source: EP)
F25B 1/10 (2013.01); F25B 31/008 (2013.01); F25B 41/39 (2021.01); F25B 2400/13 (2013.01); F25B 2400/23 (2013.01); F25B 2500/19 (2013.01); F25B 2600/2513 (2013.01)
Citation (search report)
- [IA] JP 2009300023 A 20091224 - MITSUBISHI ELECTRIC CORP
- [IA] WO 2007094618 A2 20070823 - LG ELECTRONICS INC [KR], et al
- [I] EP 2175212 A1 20100414 - DAIKIN IND LTD [JP]
- See references of WO 2014010531A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2873934 A1 20150520; EP 2873934 A4 20160217; CN 104185766 A 20141203; JP 2014016119 A 20140130; JP 6029879 B2 20161124; WO 2014010531 A1 20140116
DOCDB simple family (application)
EP 13816457 A 20130705; CN 201380012332 A 20130705; JP 2012154621 A 20120710; JP 2013068515 W 20130705