EP 2880685 A1 20150610 - MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE
Title (en)
MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE
Title (de)
NACH UNTEN ZEIGENDE MEHRFACHCHIPSTAPELUNG FÜR ZWEI ODER MEHR CHIPS
Title (fr)
EMPILAGE DE MULTIPLES PUCES FACE AU-DESSOUS POUR DEUX PUCES OU PLUS DE DEUX PUCES
Publication
Application
Priority
- US 201213565613 A 20120802
- US 201313741890 A 20130115
- US 2013053240 W 20130801
Abstract (en)
[origin: WO2014022675A1] A microelectronic assembly (100) can include a substrate (102) having first and second surfaces (104, 106) each extending in first and second transverse directions D1, D2, a peripheral edge (3) extending in the second direction, first and second openings (116, 126) extending between the first and second surfaces, and a peripheral region P1 of the second surface extending between the peripheral edge and one of the openings. The assembly (100) can also include a first microelectronic element (136) having an edge (146) extending between front and rear surfaces (140, 138) thereof and a second microelectronic element (153) having a front surface (157) facing the rear surface of the first microelectronic element and projecting beyond the edge. The assembly (100) can also include a plurality of terminals (110) exposed at the second surface (106), at least one of the terminals (110a) being disposed at least partially within the peripheral region P1.
IPC 8 full level
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01)
CPC (source: EP KR)
H01L 23/13 (2013.01 - EP KR); H01L 23/49816 (2013.01 - EP KR); H01L 23/50 (2013.01 - EP); H01L 24/05 (2013.01 - KR); H01L 24/06 (2013.01 - KR); H01L 24/32 (2013.01 - KR); H01L 24/48 (2013.01 - KR); H01L 24/49 (2013.01 - KR); H01L 24/73 (2013.01 - KR); H01L 25/0657 (2013.01 - EP KR); H01L 24/05 (2013.01 - EP); H01L 24/06 (2013.01 - EP); H01L 24/32 (2013.01 - EP); H01L 24/48 (2013.01 - EP); H01L 24/49 (2013.01 - EP); H01L 24/73 (2013.01 - EP); H01L 2224/05555 (2013.01 - EP); H01L 2224/06136 (2013.01 - EP); H01L 2224/32145 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP); H01L 2224/48091 (2013.01 - EP); H01L 2224/4824 (2013.01 - EP); H01L 2224/49095 (2013.01 - EP); H01L 2224/49175 (2013.01 - EP); H01L 2224/73215 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP); H01L 2924/15311 (2013.01 - EP); H01L 2924/181 (2013.01 - EP)
Citation (search report)
See references of WO 2014022675A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2014022675 A1 20140206; CN 104718619 A 20150617; EP 2880685 A1 20150610; JP 2015523742 A 20150813; KR 20150040998 A 20150415
DOCDB simple family (application)
US 2013053240 W 20130801; CN 201380051357 A 20130801; EP 13750213 A 20130801; JP 2015525599 A 20130801; KR 20157005424 A 20130801